Fully Automatic Ultrasonic Cleaning Machine For Semiconductor Silicon Wafers

1. Fully Automatic Ultrasonic Cleaning Machine for Semiconductor Silicon Wafers

   Precision Cleaning Redefined for Advanced Semiconductor Manufacturing

   Product Overview

   Designed to meet the ultra-high cleanliness requirements of semiconductor silicon wafers, the JTM-10720AD is a fully automatic ultrasonic cleaning system that combines cutting-edge technology with intelligent automation. Engineered for 300mm and 200mm wafers, this system eliminates sub-micron particles, organic residues, and metal ions from wafer surfaces, ensuring flawless performance in lithography, etching, and thin-film deposition processes. With a modular 10-tank design and SEMI-compliant materials, it delivers consistent, repeatable results for critical pre- and post-fabrication cleaning.

   Core Functions & Technical Excellence

   1. Multi-Stage Ultrasonic Cleaning Process

   • 40kHz High-Frequency Cavitation:
     Generates micro-bubbles that implode on wafer surfaces, dislodging particles as small as 0.2μm without physical contact. Ideal for removing photoresist residues, metal contaminants, and native oxides from delicate semiconductor materials.
   • 10-Tank Integrated Workflow:
     • Tanks 1-2: Pre-wash with DI water and megasonic agitation to loosen heavy debris.
     • Tanks 3-6: Ultrasonic cleaning with chemical solutions (e.g., SC1/SC2 for RCA cleaning) at 60–100°C to eliminate organic and ionic contaminants.
     • Tanks 7-9: Multi-stage DI water rinses with ultra-filtration (0.1μm) to prevent cross-contamination.
     • Tank 10: DryN₂™ rapid drying system with heated nitrogen (≤5% RH) to achieve spot-free, static-free surfaces.

   2. Fully Automated Intelligent Control

   • PLC + HMI Interface:
     15-inch touchscreen allows programming of 100+ custom recipes, real-time monitoring of parameters (temperature, ultrasonic power, rinse flow rate), and OEE (Overall Equipment Effectiveness) tracking.
   • Robotic Wafer Handling:
     Precision robotic arm with Teflon-coated grippers ensures gentle, edge-safe wafer transfer (≤1.5m/s speed) between tanks, minimizing particle generation and breakage.

   3. High-Purity Material Design

   • Wetted Components:
     Tanks and nozzles constructed from electropolished 316L stainless steel (Ra < 0.2μm) and PTFE, eliminating metal ion leaching and chemical corrosion.
   • Closed-Loop Filtration:
     Recirculating filtration systems with 0.1μm membrane filters and UV oxidation reduce chemical consumption by 60% and ensure cleaning fluid purity (TOC < 5ppb).

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