Product Introduction: Semiconductor Silicon Wafer Cleaning System
Tailored for semiconductor manufacturing workflows, this precision cleaning system integrates multi-stage ultrasonic processes to achieve ultra-high surface purity of silicon wafers, critical for ensuring device yield and performance in IC fabrication and MEMS processing.
Core Cleaning Stages:
- Ultrasonic Alkaline Cleaning: Utilizes cavitation effect at adjustable frequencies to dissolve organic residues, photoresist remnants, and particulate contaminants from wafer surfaces and microstructures, preparing substrates for subsequent acid treatment.
- Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxide layers) via frequency-optimized ultrasonic energy, enhancing chemical reactivity to dislodge submicron contaminants embedded in patterned structures or wafer edges.
- DI Water Rinsing: Implements high-purity deionized water circulation to eliminate residual chemicals, ensuring surface neutrality and meeting strict conductivity standards (≤18.2MΩ·cm) required for advanced semiconductor processing.
Technical Parameters:
- Ultrasonic Frequency Range: 40KHz-80KHz (multi-band adjustable, enabling precise matching to contamination types and wafer geometries)
- Process Temperature: 60℃ (thermostatically controlled to optimize chemical reaction rates while preventing wafer damage)
- Material Compatibility: Constructed with PFA-lined tanks and quartz components to resist corrosive chemistries, avoiding secondary contamination.
Key Advantages:
- Achieves sub-50nm particle removal efficiency, compliant with SEMI F020 standards
- Frequency-tunable ultrasonic modules adapt to bare wafers, patterned wafers, and thin films
- Integrated temperature control ensures consistent cleaning efficacy across batch processing
- Seamless integration with upstream wafer handling systems and downstream lithography/etching processes
Application: Ideal for pre-diffusion, pre-deposition, and post-etch cleaning in 4-inch to 12-inch silicon wafer manufacturing lines.
Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, DI water rinsing, 40-80KHz, 60℃ process, silicon wafer surface treatment