MachineU > China Products > Rubber & Plastics
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling
Specifications
Brand Name :
Ziitek
Model Number :
TIF500-30-11E
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products nameunication Products Lapt :
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling
Thickness :
0.25mm~5.0mm(0.010"~0.200")
Application :
Network Communication Products Laptop CPU/GPU Cooling
Density :
3.1 g/cm³
Dielectric Breakdown Voltage :
>5500 VAC
Thermal conductivity :
3.0W/m-K
Color :
Dark Gray
Operating Temp :
-40~200℃
Keywords :
Thermal gap pad
Description

3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Product introduction

TIF®500-30-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features


> Good thermal conductive: 3.0W/mK
> Ultra-soft and highly conformable
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

Applications


> Cooling components to the chassis of frame
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Mass storage devices
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

Typical Properties of TIF®500-30-11E Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.1 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Send your message to this supplier
Send Now

3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling

Ask Latest Price
Watch Video
Product Detail
Brand Name :
Ziitek
Model Number :
TIF500-30-11E
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling
3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products CPU Thermal Pad
MachineU China Products Rubber & Plastics
Contact Supplier
Submit Requirement