Specifications
Thickness :
2.5mmT
Keywords :
CPU Thermal Pad
Breakdown Voltage(V/mm) :
≥5500
Thermal conductivity :
1.5W/m-K
Color :
Green
Density :
2.10g/cm³
Application :
RDRAM Memory Modules
Products name :
Ideal Gap Filler 1.5W/MK CPU Thermal Pad Outstanding Thermal Performance For RDRAM Memory Modules
Brand Name :
Ziitek
Model Number :
TIF1100-07S Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Description
Ideal Gap Filler 1.5W/MK CPU Thermal Pad Outstanding Thermal Performance For RDRAM Memory Modules
Product Overview
The TIF® 1100-07S Series is designed to optimize gap heat transfer, filling gaps and completing heat transfer between heating and cooling components. It also provides insulation, damping, and sealing functions to meet equipment miniaturization and ultra-thin design requirements.
Key Features
  • Good thermal conductivity: 1.5W/mK
  • Available in various thicknesses
  • Moldability for complex parts
  • Broad range of hardnesses available
  • High tack surface reduces contact resistance
  • Easy release construction
Applications
  • LED TV / LED Lit Lamps
  • CD-Rom, DVD-Rom cooling
  • SAD-DC Power Adapters
  • CPU
  • Memory Modules
  • Rainproof LED Power
  • Telecommunication hardware
  • Mainboard/Mother board
  • IT infrastructure
  • GPS navigation and other portable devices
  • LED Flexible strip, LED bar
Technical Specifications
Property Value Test Method
Color Green Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.2 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0
ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470 / ISO22007
Product Details
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Certifications
ISO9001:2015
ISO14001:2004
IATF16949:2016
IECQ QC 080000:2017
UL
Packaging & Lead Time
Packaging:
  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available
Lead Time: Quantity: 5000 pieces - To be negotiated
Ideal Gap Filler 1.5W/MK CPU Thermal Pad Outstanding Thermal Performance For RDRAM Memory Modules
Frequently Asked Questions
Q: What is your terms of payment?
A: Payment ≤ 2000USD, T/T in advance. For established customers with timely payments, we can apply other payment terms such as monthly payments or 30-day terms.
Company Advantages
Ziitek has an independent R&D team with extensive experience and well-equipped testing equipment. We can conduct tests with customer samples to find the most suitable thermal conductive materials for each application.
Our Services
Online Service: 12 hours daily, fastest inquiry response
Working Hours: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
Staff: Well-trained and experienced English-speaking team
Packaging: Standard export carton or customized with customer information
Samples: Free samples available
After-Service: Comprehensive support and satisfactory solutions for any product issues.
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Ideal Gap Filler 1.5W/MK CPU Thermal Pad Outstanding Thermal Performance For RDRAM Memory Modules

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Thickness :
2.5mmT
Keywords :
CPU Thermal Pad
Breakdown Voltage(V/mm) :
≥5500
Thermal conductivity :
1.5W/m-K
Color :
Green
Density :
2.10g/cm³
Contact Supplier
video
Ideal Gap Filler 1.5W/MK CPU Thermal Pad Outstanding Thermal Performance For RDRAM Memory Modules
Ideal Gap Filler 1.5W/MK CPU Thermal Pad Outstanding Thermal Performance For RDRAM Memory Modules
Ideal Gap Filler 1.5W/MK CPU Thermal Pad Outstanding Thermal Performance For RDRAM Memory Modules

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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