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CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Specifications
Hardness :
12 shore 00
Thickness :
5.0mmT
Color :
Dark gray
Thermal conductivity :
3.0W/mK
Density :
3.15g/cm³
Keywords :
Thermal Pad
Brand Name :
Ziitek
Model Number :
TIF1200-30-11ES thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
24*13*12cm cartons
Sample :
Free
Products name :
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Description
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Product Overview
The TIF®1200-30-11ES Series is a thermal pad specifically designed to tackle high-level cooling challenges and environments sensitive to extreme mechanical stress. It combines high thermal conductivity with near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and high heat flux electronic components.
Key Features
  • Good thermal conductivity: 3.0W/mK
  • Thickness: 5.0mm
  • Hardness: 12 Shore 00
  • Moldability for complex parts
  • High tack surface reduces contact resistance
  • Fiberglass reinforced for puncture, shear and tear resistance
Applications
  • Power supply
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • IT infrastructure
  • GPS navigation and other portable devices
  • CD-Rom, DVD-Rom cooling
  • New energy vehicle
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Technical Specifications of TIF®100-30-11ES
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.15 ASTM D792
Thickness Range (inch/mm) 0.020~0.030 (0.50~0.75) | 0.040~0.200 (1.00~5.00) ASTM D374
Hardness (Shore 00) 12 ASTM 2240
Continuous Use Temp -40 to 200℃ ***
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity ＞1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470 / ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Company Advantages
Ziitek has an independent R&D team with experience, rigorous and pragmatic approach. They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we can also perform tests with customers' samples to find more suitable Ziitek materials for every customer.
Frequently Asked Questions
Q: Do you offer free samples?
A: Yes, we are willing to offer free samples.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Product tags

heat conductive silicone sheet

,

silicon heat sheet

,

thermally conductive silicone sheet
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CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling

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Product Detail
Hardness :
12 shore 00
Thickness :
5.0mmT
Color :
Dark gray
Thermal conductivity :
3.0W/mK
Density :
3.15g/cm³
Keywords :
Thermal Pad
Contact Supplier
video
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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