CPU High Thermal Conductivity Die Cut Silicon Thermal Pad Video from China

Thermal Gap Pad

Aug 14, 2025

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Product Description: CPU high thermal conductivity die cut silicon thermal pad Ziitek TIF760HP is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product ...learn more

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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10 Years

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