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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
Specifications
Brand Name :
ZIITEK
Model Number :
TIF760PUS thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Name :
CPU high thermal conductivity die cut silicon thermal pad
keyword :
thermal interface material
Applications :
CPU PC GPU
Material :
Ceramic filled silicone elastomer
Thermal conductivity :
7.5W/m-K
Thickness :
1.5 mmT
Description

CPU high thermal conductivity die cut silicon thermal pad

Ziitek TIF760HP is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF700PUS-data sheet.pdf

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

Features

> Good thermal conductive: 7.5 W/mK

> Thickness: 1.5 mmT

> hardness:20

> Colour: gray

> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance

Applications

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

Typical Properties of TIF760HP Series
Color
 Blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.2 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness

1.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

20
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity

7.5W/mk
ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
≥6000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.5MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
≥ 3.5X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.5 W/m-K
GB-T32064
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

Product tags

cpu thermal pads

,

heatsink cooling thermal conductive silicone pad

,

thermal pad pcb
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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF760PUS thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
10 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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