TIF^®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®070-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.

Feature
>Thermal conductivity
>Soft, very low compression
>Low thermal inpedance
>Operate automaticly
>Proven long-term reliability

Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controler
>Telecom industry
>Semiconductor 'automatic laboratory equipment.

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.