TIF^®060-16 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®060-16 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.

Feature

> Thermal conductivity: 6.0 W/mK
> Soft, very low compression
> Low thermal impedance
> Operate automatically
> Proven long-term reliability

Application

> Heat-sink & frame
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

Product Specification:
30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL