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Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Specifications
Model Number :
TIF030-10
Construction :
Ceramic filled silicon material
MOQ :
1000 tubes
Delivery Time :
7-15work days
Density(g/cm³) :
2.9
Application :
Communication Hardware
Payment Terms :
T/T
Flame rating :
94 V0
Price :
Negotiation
Thermal conductivity :
3.0 W/mK
Certification :
UL and RoHs
Color :
Gray
Supply Ability :
10000/day
Keywords :
Thermal Conductive Gel
Brand Name :
ZIITEK
Name :
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Place of Origin :
China
Continuous Use Temp :
-40-200 ℃
Packaging Details :
30 cc/pcs，50cc/pcs
Description
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

  • Thermal gap pad
  • Thermal graphite sheet/film
  • Thermal double-sided tape
  • Thermal insulation pad
  • Thermal grease
  • Phase change material
  • Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Product Description

TIF®030-10 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.

Features
  • High Thermal conductivity
  • Soft, very low compression
  • Low thermal impedance
  • Suitable for automated operation in dispensing systems
  • Proven long-term reliability
Applications
  • Heat-sink & frame
  • LED backlight module, LED lighting
  • High speed hardware driver
  • Micro heat pipe radiator
  • Vehicle engine controller
  • Communication hardware
  • Semiconductor automatic laboratory equipment
Typical Properties of TIF®030-10
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicon material -
Flow Rate (g/min)
(30cc syringe/ 2.5mm orifice/90 psi)		 12 Ziitek Test Method
Density (g/cm³) 2.9 ASTM D792
Thermal conductivity (W/mK) 3.0 ASTM D5470
Thermal impedance (℃-in²/W) @10psi 0.11 ASTM D5470
Thermal impedance (℃-in²/W) @50psi 0.10 ASTM D5470
Recommended Operating Temperature -40~200℃ -
Breakdown Strength (V/mm) ≥4000 ASTM D149
Volume Resistivity (Ohm*cm) ＞1.0x10¹¹ ASTM D257
Bond line Thickness (mm) 0.10 -
Flame Rating V-0 UL 94
Oil Separation (%) @ 150°C, 24 hrs ＜0.03 -
Volatility Loss (%) @150°C, 24 hrs ＜0.2 -
Product Specifications

30cc/pcs, 50cc/pcs, 300 cc/pc

For more information about thermal conductive materials, please contact our company.

Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Our Services
  • Online-service: 12 hours, Inquiry reply within fastest
  • Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff are to answer all your inquiries in English
  • Standard Export Carton Or Marked With Customer's Information Or Customized
  • Provide free samples
  • After-service: Even our products have passed strict inspection, if you find the parts cannot work well, please show us the proof. We will help you to deal with it and give you satisfactory solution
Certifications
ISO9001:2015 ISO14001:2004 IATF16949:2016 IECQ QC 080000:2017 UL
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Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware

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Product Detail
Model Number :
TIF030-10
Construction :
Ceramic filled silicon material
MOQ :
1000 tubes
Delivery Time :
7-15work days
Density(g/cm³) :
2.9
Application :
Communication Hardware
Contact Supplier
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware
Low Thermal Impedance One Component 3.0W/mK Thermal Conductive Gel For Communication Hardware

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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