0.8W/mK Good Thermal Conductivity Efficiency Thermal Conductive Double Side Tape For Communication Equipment
The TIA®800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong adhesive strength and good thermal conductivity, aiming to replace traditional mechanical fixation and thermal conductive silicone grease, simplify assembly processes, improve product reliability, and are an ideal choice for solving the heat dissipation challenges of modern compact electronic devices.
Features
> Thermal Conductivity: 1.2 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
| Typical Properties of TIA®800FG Serie |
| Product Name |
TIA®808FG |
Test Method |
| Color |
White |
Visual |
| Adhesive Type |
Acrylic Adhesive |
- |
| Backing Type |
Fiberglass |
- |
| Recommended Operating Temperature(℃) |
-40 ~ 125 |
- |
| Composite Thickness(inch/mm) |
0.008/0.20 |
ASTM D374 |
| Voltage Breakdown(V)) |
≥3500 |
ASTM D149 |
| Thermal Conductivity(W/mK) |
0.8 |
ASTM D5470 |
| 180° Peel Adhesion (gf/inch) Steel, Immediate |
≥ 1000 |
ASTM D3330 |
| 180° PeelA dhesion (gf/inch) Steel, Steel 24 hrs |
≥ 1200 |
ASTM D3330 |
| Holding Power (H/inch) @25℃ |
≥ 48 |
ASTM D3654 |
| Holding Power (H/inch) @80℃ |
≥ 48 |
ASTM D3654 |
Product Specifications
Standard Thickness: 0.005" (0.13 mm),0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm), 0.015" (0.38 mm), 0.020" (0.51 mm),
Standard Size: 16" × 100" (406 mm × 30.48 m)
Reinforcing Carrier: TIA®800FG Series rolls can be reinforced with fiberglass.
The TIA® Series can be provided with die-cutting into various shapes.For different thicknesses or more information about thermally conductive materials, please contact our company.
Company Profile
Dongguan Ziitek Electronic Material and Technology Co., Ltd. (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.