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Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Specifications
180° Peel Adhesion (gf/inch) Steel, Steel 24 hrs :
≥1200
Payment Terms :
T/T
Color :
White
Price :
Negotiation
Products name :
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Keywords :
Thermal Adhesive Tape
Thermal Conductivity :
0.8W/mK
Application :
For Mounting Heat Sinks And Managing Semiconductor Heat
Thickness(inch/mm） :
0.010"/0.25mm
Voltage Breakdown(V)) :
≥4000
Brand Name :
Ziitek
Model Number :
TIA810FG
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Delivery Time :
3-7 Work days
Packaging Details :
10RL/bag
Description

Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat


The TIA®800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong adhesive strength and good thermal conductivity, aiming to replace traditional mechanical fixation and thermal conductive silicone grease, simplify assembly processes, improve product reliability, and are an ideal choice for solving the heat dissipation challenges of modern compact electronic devices.

Features

> High bonding strength
> Good thermal conductivity efficiency
> Easy to apply and can be die-cut into custom sizes
> Stable operation over a wide temperature range

Applications

> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

Typical Properties of TIA®800FG Serie
Product Name TIA®805FG TIA®806FG TIA®808FG TIA®810FG TIA®812FG TIA®815FG TIA®820FG Test Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Fiberglass ********
Recommended Operating Temperature(℃) -40 ~ 125 ********
Composite Thickness(inch/mm)

0.005

0.13

0.006

0.15

0.008

0.20

0.010

0.25

0.012

0.30

0.015

0.38

0.020

0.51

 ASTM D374
Voltage Breakdown(V)) ≥2500 ≥3000 ≥3500 ≥4000 ≥4200 ≥4500 ≥5000 ASTM D149
Thermal Conductivity(W/mK) 0.8 ASTM D5470
180° Peel Adhesion (gf/inch) Steel, Immediate ≥ 1000 ASTM D3330
180° PeelA dhesion (gf/inch) Steel, Steel 24 hrs ≥ 1200 ASTM D3330
Holding Power (H/inch) @25℃ ≥ 48 ASTM D3654
Holding Power (H/inch) @80℃ ≥ 48 ASTM D3654


Product Specifications

Standard Thickness: 0.005" (0.13 mm),0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm), 0.015" (0.38 mm), 0.020" (0.51 mm),
Standard Size: 16" × 100" (406 mm × 30.48 m)
Reinforcing Carrier: TIA®800FG Series rolls can be reinforced with fiberglass.

The TIA® Series can be provided with die-cutting into various shapes.For different thicknesses or more information about thermally conductive materials, please contact our company.
Company profile
Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

Independent R&D team


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Product tags

thermal conductive adhesive for led

,

thermally conductive silicone adhesive

,

thermally conductive adhesive
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Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat

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Product Detail
180° Peel Adhesion (gf/inch) Steel, Steel 24 hrs :
≥1200
Payment Terms :
T/T
Color :
White
Price :
Negotiation
Products name :
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Keywords :
Thermal Adhesive Tape
Contact Supplier
video
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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