Hing Technology Co. Ltd
Verified Supplier
1 Years
shenzhen
Since 2016
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Supplier Homepage > Products > Substrate PCB

PRODUCT CATEGORIES

HDI PCBs

 (29)

Multilayer PCB

 (15)

Rigid Flex PCB

 (26)

Substrate PCB

 (15)

SLP Substrate Like PCB

 (14)

IMS PCB

 (7)

Custom PCB Assembly

 (22)

Electronic Component

 (10)

Antenna PCB

 (28)

RTK GNSS Antenna

 (148)
Product Categories

Substrate PCB

15
Choose from our substrate pcb products, find out more, and feel free to inquiry us
Polyimide IC substrate PCB built to operate from negative 40 degrees Celsius to 130 degrees Celsius ensuring electronic connections
Hot selling!
Substrate PCB

Polyimide IC substrate PCB built to operate from negative 40 degrees Celsius to 130 degrees Celsius ensuring electronic connections
Model：H-STP
Application：High Frequency Circuits, RF Modules, LED Lighting, Automotive Electronics
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Working Temp -40 to 85 Substrate PCB with Minimum Trace Spacing 3 Mil 0.075mm Suitable Automotive Electronics Solutions
Hot selling!
Substrate PCB

Working Temp -40 to 85 Substrate PCB with Minimum Trace Spacing 3 Mil 0.075mm Suitable Automotive Electronics Solutions
Model：H-STP
Working Temp：-40~+85
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Dielectric Constant 3.5 to 10 Substrate PCB Featuring FR4 Rogers Polyimide Ceramic Materials and Minimum Trace Spacing 3 Mil 0.075mm
Hot selling!
Substrate PCB

Dielectric Constant 3.5 to 10 Substrate PCB Featuring FR4 Rogers Polyimide Ceramic Materials and Minimum Trace Spacing 3 Mil 0.075mm
Model：H-STP
Minimum Trace Spacing：3 Mil (0.075mm)
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High Frequency Circuits Substrate PCB Featuring Copper Thickness 0.5oz to 3oz Number Of Layers 1 to 32 Layers Designed for Electronic Systems
Substrate PCB

High Frequency Circuits Substrate PCB Featuring Copper Thickness 0.5oz to 3oz Number Of Layers 1 to 32 Layers Designed for Electronic Systems
Model：H-STP
Material：FR4 / Rogers / Polyimide / Ceramic
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AC AC-PCB-M159 High-Frequency LED Heavy Copper FR-4 36um 1.6mm Thick OSP Surface 2-10 Layers High TG PCB
Substrate PCB

AC AC-PCB-M159 High-Frequency LED Heavy Copper FR-4 36um 1.6mm Thick OSP Surface 2-10 Layers High TG PCB
Supply Ability：500000pcs/month
MOQ：50
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Automotive Electronics Package Substrate Featuring Copper Thickness 0.5oz 3oz Suitable for Electronic Device Production
Substrate PCB

Automotive Electronics Package Substrate Featuring Copper Thickness 0.5oz 3oz Suitable for Electronic Device Production
Model：H-STP
Material：FR4 / Rogers / Polyimide / Ceramic
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Minimum Trace Spacing 3 Mil Substrate PCB Working Temp minus 40 to plus 85 Surface Finish HASL ENIG OSP Immersion Silver Immersion Tin
Substrate PCB

Minimum Trace Spacing 3 Mil Substrate PCB Working Temp minus 40 to plus 85 Surface Finish HASL ENIG OSP Immersion Silver Immersion Tin
Model：H-STP
Material：FR4 / Rogers / Polyimide / Ceramic
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Thickness 0.1mm to 3.0mm Substrate PCB Ideal for High Frequency Circuits Operating Between Negative 40 Degrees Celsius and 130 Degrees Celsius
Substrate PCB

Thickness 0.1mm to 3.0mm Substrate PCB Ideal for High Frequency Circuits Operating Between Negative 40 Degrees Celsius and 130 Degrees Celsius
Model：H-STP
Operating Temperature：-40°C To 130°C
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Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers Polyimide Ceramic Designed for Signal Transmission
Substrate PCB

Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers Polyimide Ceramic Designed for Signal Transmission
Model：H-STP
Minimum Trace Spacing：3 Mil (0.075mm)
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Supplier Medical Device 4-Layer Heavy Copper Printed Circuit Board with Gold Plating High Quality 4-Layer Ceramic PCB & PCBA
Substrate PCB

Supplier Medical Device 4-Layer Heavy Copper Printed Circuit Board with Gold Plating High Quality 4-Layer Ceramic PCB & PCBA
Supply Ability：500000pcs/month
MOQ：50
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Working Temp minus 40 to plus 85 BT substrate featuring thermal conductivity between 0.3 and 3.0 W per meter Kelvin for performance
Substrate PCB

Working Temp minus 40 to plus 85 BT substrate featuring thermal conductivity between 0.3 and 3.0 W per meter Kelvin for performance
Model：H-STP
Working Temp：-40~+85
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HTCC Power Electronics' Heavy Copper Multilayer Printed Circuit Board (PCB & PCBA) with Ceramic High-End Performance
Substrate PCB

HTCC Power Electronics' Heavy Copper Multilayer Printed Circuit Board (PCB & PCBA) with Ceramic High-End Performance
Supply Ability：500000pcs/month
MOQ：50
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High-Density Heavy Copper Automotive FR-4 PCB with 36um Copper 1.6mm Thickness & OSP Finish
Substrate PCB

High-Density Heavy Copper Automotive FR-4 PCB with 36um Copper 1.6mm Thickness & OSP Finish
Supply Ability：500000pcs/month
MOQ：50
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Minimum Trace Width 3 Mil IC Substrate Copper Thickness 0.5oz to 3oz Ideal for Electronic Packaging and Semiconductor Applications
Substrate PCB

Minimum Trace Width 3 Mil IC Substrate Copper Thickness 0.5oz to 3oz Ideal for Electronic Packaging and Semiconductor Applications
Model：H-STP
Material：FR4 / Rogers / Polyimide / Ceramic
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Multilayer Ceramic Hybrid PCB with Heavy Copper Durable Printed Circuit Board for Harsh Environments
Substrate PCB

Multilayer Ceramic Hybrid PCB with Heavy Copper Durable Printed Circuit Board for Harsh Environments
Supply Ability：500000pcs/month
MOQ：50
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