Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first, technology as the core, and customer demand as the orientation, focusing on the high-end segmented circuit board market covering an area of approximately 10000 square meters.

The company's products are widely used in communication, new energy, industrial control, consumer electronics, automotive electronics and medical electronics and other application fields, and the products serve well-known customers at home and abroad.

• With up to 14 layer any layer capability
• Min line width and spacing in volume production is around 40μm
• Fine pitch BGA with 0.35mm
• Capability of plated copper or filled with conductive paste for stacked microvias
• Heavy Copper, embedded coin and provide a thermal management solution
• Support planar surface for ball grid array ("BGA") (Via-in-Pad) Enhance impedance performance
• Enhance impedance performance
• Microvias solutions for Radio Frequency HDI boards
• High speed material for hybrid HDI
• Wide range laminate support (Low Tg , high Tg material and halogen free material )
• Low-DK laminate for smart devices
• Signal integrity enhancement
• Edge plating capability

• Technical Parameter

• o.	Capabilities			Standard Production	Advanced Production
  1	Stack up	Blind/Buried/Anylayer board	Lamination times	MAX≤5times	MAX≤6times
  		Copper thickness	Inner layer	1/3OZ-2oz MAX 2OZ	1/4OZ-2oz MAX OZ
  			Outer layer	1/3OZ-3OZ	1/3OZ-2OZ
  		Min Dielectric ThK		35um(1027)	30um (1017)
  		Structure		1-N-1 / 2-N-2 / 3-N-3	1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / ELIC(12L)
  		Layer count		4-24	4-34
  2	Min. Line/Space	Min L/W (inner)		2/2mil (50/50um)	1.6/1.6 mil ( 40/40um)
  		Min. L/W (Outer)		2.4/2.4mil (60/60um)	2/2mil (50/50um)
  3	Line/Space	Inner Layer	Tenting	2/2mil (50/50um)	1.6/1.6 mil ( 40/40um)
  			mSAP	1.4/1.4mil (40/40um)	1.2/1.2mil (35/35um)
  		Outer layer	Tenting	3/3mil (75/75um)	2.4/2.4 mil ( 60/60um)
  			mSAP	2.4/2.4mil (60/60um)	2/2mil (50/50um)
  		Pad size	inner layer min size	225um	200um
  			outter layer min size	225um	200um
  4	Drill	min Mechanical Drill size		0.2mm	0.15mm
  		PTH plating A/R		≤8:1	≤10:1
  		PTH Hole Tolerance		±0.075mm	±0.075mm
  		NPTH Hole Tolerance		±0.05mm	±0.05mm
  		Plated slot tolerance	Long slot	±0.075mm	±0.075mm
  			Short Slot	±0.1mm	±0.1mm
  5	Min BGA	Min BGA/ BGA pitch		0.4	0.35
  6	Laser	Min. Laser hole size		75um	50um
  		Min. distance from laser hole to laser hole		0.025mm	0.025mm
  		Laser hole plating A/R		≤0.8:1	≤1:1
  7	Soldermask	Color		Green,Yellow,Black,Blue,Red, White, Matt green	Green,Yellow,Black,Blue,Red, White, Matt green
  		SM ThK	Single print thickness	10-30um	10-30um
  		Min SM dam		3.0mil	2.5mil
  8	Impedance	Capability of Impedance	Single line impedance<50Ω	±3.5Ω	±3.5Ω
  			Single line impedance≥50Ω	±10%	±7%
  			Differential line impedance	±10%	±7%
  9	Tolerance capability	Patten size tolerance	pad size tolerance	±20%	±15%
  			line tolerance	±20%	±15%
  			patten to outline	+/- 0.0075mm	+/- 0.0050mm
  		Registration tolerance	laser A/R	100um	75um
  			PTH A/R	100um	75um

• 

• Your inquiry will be replied within 12 hours
• Well-trained & experienced sales can reply your inquiries in English
• During working time, E-mail will be replied to you within 2 hours
• OEM & ODM projects are highly welcomed, we have strong R&D team
• The order will be produced exactly according to order details and proofed samples, our QC will submit inspection report before shipment
• Your business relationship with us will be confidential to any third party
• Good after-sale service