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28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
Specifications
Delivery Time :
30-40 days
Certification :
CE ROHS
working Temp. :
-40~+85
Payment Terms :
T/T,L/C,D/P,D/A,Western Union
Place of Origin :
CN
Brand Name :
Hing
Product Name :
HDI Printed Circuit Board Pcb
MOQ :
50
Supply Ability :
500000pcs/month
Packaging Details :
1set/box
Description
AI server pcb R5785GN 28-layer back-drilling pcb
Company Introduction

Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first, technology as the core, and customer demand as the orientation, focusing on the high-end segmented circuit board market covering an area of approximately 10000 square meters.

The company's products are widely used in communication, new energy, industrial control, consumer electronics, automotive electronics and medical electronics and other application fields, and the products serve well-known customers at home and abroad.

OUR HDI Capability

Definition: HDI PCBs utilize microvias, blind/buried vias, and build-up structures to achieve higher wiring density per unit area — ideal for space-constrained applications.

Key Applications: Smartphones, wearables, medical endoscopes, automotive ADAS modules, portable electronics.

28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support

Common HDI PCB Stack-ups

Understanding the various stack-up configurations in HDI PCBs allows designers greater flexibility in layer assignment, component placement, and routing. This enables more efficient use of space and better optimization of the board layout. The common HDI PCB stack-up structures are illustrated in the diagram below.

28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support

Featured Product Solutions

After years of dedicated R&D and continuous technological advancement, Hing has established itself as a benchmark in the rapid manufacturing of small to medium-volume HDI PCBs. Evolving from early 1+N+1 and 2+N+2 stack-ups to today’s advanced 3+N+3, 5+N+5, 6+N+6, and 7+N+7 configurations, we have successfully transitioned from fast prototyping to reliable high-volume production. This journey reflects our commitment to stringent quality assurance and has shaped Puruidy into a trusted name in precision PCB manufacturing.


28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support

Frequently Asked Questions
Do you offer samples?
Yes, we offer samples for testing.
What's your MOQ?
Our MOQ is 1 pcs, the first order is negotiable.
How do you test your products?
We use AOI or Flying Probe Test or Bed of Nails Test or Impedance Test.
Do you make OEM products?
Yes, we can do.
Do you have RoHS certification?
We can do RoHS certification according to customers' requirements. The customers need to charge the handing fee. Or we can provide customers the SGS report of the material for free.
Our Services
  • Your inquiry will be replied within 12 hours
  • Well-trained & experienced sales can reply your inquiries in English
  • During working time, E-mail will be replied to you within 2 hours
  • OEM & ODM projects are highly welcomed, we have strong R&D team
  • The order will be produced exactly according to order details and proofed samples, our QC will submit inspection report before shipment
  • Your business relationship with us will be confidential to any third party
  • Good after-sale service
Send your message to this supplier
Send Now

28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support

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Product Detail
Delivery Time :
30-40 days
Certification :
CE ROHS
working Temp. :
-40~+85
Payment Terms :
T/T,L/C,D/P,D/A,Western Union
Place of Origin :
CN
Brand Name :
Hing
Contact Supplier
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28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support
28-Layer Back-Drilling HDI PCB for AI Server Applications, High-Density Interconnect Printed Circuit Board with Fine Pitch BGA Support

Hing Technology Co. Ltd

Verified Supplier
1 Years
shenzhen
Since 2016
Business Type :
Manufacturer, Seller, Exporter
Main Products :
HDI PCBs, Multilayer PCB, Rigid Flex PCB
Total Annual :
4000000-5000000
Employee Number :
200~300
Certification Level :
Verified Supplier
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