High Pressure Automatic Pneumatic Stencil Cleaner with 4-Stage Filtration System – 360° Rotary Spray for Stencil, Misprint PCB Board & Scraper Cleaning
Product Introduction
- The Pneumatic Stencil Cleaner is designed for the SMT (Surface Mount Technology) production line. It efficiently removes solder paste, red glue, flux, and other high‑viscosity residues from:
- SMT stencils (laser‑cut, step, and frameless)
- Misprinted PCB boards
- Squeegees / scrapers (metal or polyurethane)
- Copper screens, fixtures, pallets, and tooling
- By operating entirely on compressed air, the machine eliminates electrical ignition risks, making it ideal for environments where safety is paramount.
Key Applications
- SMT laser stencils / step stencils
- Misprinted PCB assemblies
- Printing squeegees (metal or rubber)
- Copper screens and silk screens
- Wave solder pallets, fixtures, and carriers
- Components with residual high‑viscosity adhesives
Technical Specifications
| Applicable steel mesh sizeb: |
L750 × W750 × H40 (mm) [Extra large sizes need to be customized] |
| Overall dimensions : |
L1000×W700×H1730 (mm) |
| Liquid tank maximum capacity |
40 liters |
| Optimum liquid usage |
30 liters |
| Cleaning method: |
360°rotating double-sided isobaric spray roll high-pressure spray (cleaning + drying) |
| Cleaning time |
2-5min(for reference only) |
| Drying time |
2-5min(for reference only) |
| External air source |
0.4~0.7 (Mpa) |
| Air consumption |
400~600(L/Min) |
| Exhaust port size |
Φ125×H25(mm) |
| Filtration system (first level) |
First level filter: (filters impurities and labels) |
| Filtration system (secondary) |
Secondary filter: (filters solder paste and rosin particles) |
| Filtration system (three levels) |
Third level filter: 5㎛ filter element (filters solder paste and rosin particles) |
| Machine net weight: |
about 210Kg |
Machine Details
Key Features
- Fully Pneumatic Drive – No electrical connection required; powered solely by compressed air.
- 360° High‑Pressure Rotary Spray – Ensures thorough cleaning of stencil apertures, PCB surfaces, and complex tooling.
- Multi‑Stage Filtration System – Integrated 4‑stage filtration separates solder particles and contaminants, extending cleaning fluid life.
- Versatile Solvent Compatibility – Works with IPA, water‑based cleaners, and solvent‑based solutions.
- One‑Button Automatic Cycle – Combines washing, rinsing, and drying in a fully automatic sequence.
Applicable Industries
- Electronics Manufacturing Services (EMS)
- Consumer electronics (smartphones, tablets, home appliances)
- Automotive electronics (PCBs requiring high reliability)
- Medical device manufacturing (strict cleanliness standards)
- Aerospace & defense (explosion‑proof environments)
- SMT contract manufacturers
- Semiconductor packaging (post‑solder‑printing cleaning)