Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated using a heating element (called a thermode or a Hot Bar) to a sufficient temperature to melt the solder. The parts are then cooled below the solidification temperature to form a permanent electro-mechanical bond.
Compact size – perfect for desktop operations.
Precise temperature control (typically 150°C – 500°C).
Adjustable time, pressure, and heat profile.
Fine alignment system for small-pitch applications.
Cooling system for controlled solidification.
Programmable settings for repeatability.
| Model | SMTS12 |
| Machine size | 660×660×720mm |
| Working area | 120x120mm |
| Machine weight | 90Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 2 |
| Thermode head size | Max 80*5mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±3℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | 3-stage |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ, 2000W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start buttons |
| Rotation Platform | Cylinder control, tolerance<0.02mm |
For a variety of high density TAB, TCP crimping and FPC, FFC and PCB solder crimp, copper to copper, wire to PCB.
1.Component Alignment: The parts to be joined (e.g., FPC to PCB) are aligned under the hot bar.
2. Heat & Pressure Application: The hot bar heats up to a set temperature and presses down with controlled force.
3. Bond Formation: Heat transfers through the component, melting solder or adhesive on contact points.
4. Cooling: The system cools down under pressure to solidify the bond.