Heavy-Duty Epoxy Potting Glue For Transformers, Sensors & PCB | Premium Insulating & Moisture-Proof Resin

Description of Epoxy Potting Compound

HN-5508 is a premium, low-viscosity epoxy resin designed for high-performance potting, encapsulation, and sealing applications. Engineered to cure reliably at room or low temperatures, it features an extended working time and exceptional flowability. This allows the liquid resin to easily penetrate tight gaps, intricate clearances, and complex component geometries without trapping air.

technical parameter of epoxy potting compound:

Product Features of epoxy potting compound:

• Electrical Integrity: Combined flame-retardant formulation with high dielectric strength for premium insulation.
• Structural Bonding: High-strength adhesion that provides durable encapsulation and tight perimeter sealing.
• Dynamic Cushioning: Superior resistance to moisture absorption, humidity, impact shocks, and industrial vibrations.
• Thermal Stability: Engineered to withstand temperature fluctuations and environmental degradation without cracking.

Application of epoxy resin potting:

• Power & Inductive Components: Transformers, resistors, filters, ignition coils, and high-voltage flyback transformers (high-voltage packs).
• Sensors & Controls: Temperature sensors, thermistors, and temperature controllers or thermostats.
• Submersible & Aquatic Equipment: Aquarium equipment, water pumps, and waterproof aquatic electronics.
• Specialized Electronic Devices: Negative ion (anion) generators, ultrasonic atomizers, and various sensitive electronic modules.
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Physical Properties of epoxy potting compound:

How to use epoxy potting compound:

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1. Surface Prep: Clean and dry the substrate thoroughly.
2. Weigh & Mix: Combine Part A and Part B at a strict 5:1 weight ratio. Stir well for 2–3 minutes.
3. Degas: Vacuum de-air for 3–5 minutes to remove bubbles.
4. Apply & Cure: Pour slowly and allow to cure at room temperature or accelerate with heat.

25kg/barrel