This document provides detailed package information for the HVSOF5 package, including its structure, packing specifications, dimensions, marking, storage, and soldering conditions. It is intended for use in general electronic equipment.
| Category | Specification | Details |
|---|---|---|
| Package | Package Name | HVSOF5 |
| Package | Type | SOP |
| Package | Pin Count | 5 |
| Package | Weight [g] | 0.003 |
| Package | Lead Finish | Pure Tin |
| Package | MSL Level | 1 |
| Packing | Packing Form | Tape&Reel |
| Packing | Packing Quantity [pcs] | 3,000 |
| Packing | PIN 1 Orientation | TR |
| Packing | Material - Embossed carrier tape | PS |
| Packing | Material - Cover tape | PET+PE |
| Packing | Material - Reel | PS |
| Packing | Material - Unit box | Cardboard |
| Packing | Material - Shipping box | Cardboard |
| Packing | Leader specification | No component pockets are 160mm or more. |
| Packing | Trailer specification | No component pockets are 40 mm or more. Tape is free from reel. |
| Packing | Cover tape peelback strength | 0.2 N to 0.7 N |
| Packing | Missing ICs | (1) No consecutive dropouts. (2) A maximun 0.1 % of specified number of products in each packing may be missing. |
| Packing | Unit box quantity | 3 reel(s) or less per unit box |
| Packing | Shipping box quantity | 4 unit boxes or less per shipping box |
| Dimensions | Shipping Box Dimension X [mm] | 190 |
| Dimensions | Shipping Box Dimension Y [mm] | 255 |
| Dimensions | Shipping Box Dimension Z [mm] | 193 |
| Storage | Recommended Storage Temperature Min. [C] | 5 |
| Storage | Recommended Storage Temperature Max. [C] | 30 |
| Storage | Recommended Storage Humidity Max. [% RH] | 85 |
| Storage | Storage period Max. [year] | 1 |
| Storage | Drying process required before solder mounting | No |
| Soldering | Wave soldering method support | No |
| Soldering | Rework by soldering iron | Not allowed |
| Soldering | Mounting on flexible film recommendation | Usage of support board and under fill is recommended. |
| Soldering | Mounting on long and narrow board recommendation | Bending board direction and outer lead direction is recommended as drawing (vertically layout) and under fill usage is recommended. |