Semiconductor Molding Machine
Apr 04, 2026
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Product Description: Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm Applicable EMC specifications: Diameter: Ф 11-...learn more
120 Tons Auto Molding System With 12KW Heating Power

120 Tons Auto Molding System With 12KW Heating Power
Taijin
China
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Guangdong Taijin Semiconductor Technology Co., Ltd

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