Shenzhen Sonch(Sanzhu) Technology Co., Ltd. is a professional high-tech enterprise focusing on SMT and THT automation equipment. Founded in 2015, the company is located in Fuyong, Bao’an District, Shenzhen, adjacent to the Shenzhen World Exhibition & Convention Center. We benefit from Shenzhen’s complete electronic manufacturing industrial chain, mature international logistics and superior foreign trade policies.

We adopt a unique business model of Manufacturing + Trade + Global Service. Our business covers independent equipment R&D and production, new/used imported equipment agency sales, and full-range supporting spare parts supply. We provide one-stop turnkey solutions for electronic manufacturing factories worldwide.

Our product lineup covers the entire electronic production process, including SMT inspection equipment, soldering equipment, core placement and insertion machines, automated peripheral equipment, as well as various spare parts and consumables. We support OEM customization, non-standard equipment customization and full production line configuration.

After years of industrial accumulation, Sonch(Sanzhu) Technology has built a professional technical R&D team, standardized production system and global foreign trade service team. With stable equipment performance, strict quality control and flexible customization capabilities, we have established long-term cooperative relationships with customers and authorized distributors across Southeast Asia, South Asia, the Middle East and other global regions.

Focusing on quality and service, we are committed to providing cost-effective SMT automation equipment and reliable technical support for global electronic manufacturers, and strive to become a trusted long-term partner in the global intelligent manufacturing industry.

1. Basic Machine Information

• Model: JUKI FX-3L Ultra-High Speed Modular Chip Mounter

• Machine Type: High-volume mass-production dedicated modular SMT placement machine

• Application: Large-scale high-speed mass production of standard miniature chip components, widely used in consumer electronics, mobile devices, LED modules, communication products and high-yield standardized SMT production lines

2. Placement Performance

• Maximum Chip Placement Speed: 74,000 CPH (theoretical optimal condition, 0.049 sec/chip)

• Standard Production Speed (IPC9850): 60,000 CPH

• Placement Accuracy (Laser Recognition): ±0.05mm (3σ, Cpk≥1.0)

• Placement Head Configuration: Dual independent high-speed laser placement heads

• Component Recognition Mode: High-speed on-the-fly laser alignment system, real-time dynamic component calibration

3. Applicable Component Specifications

• Minimum Component Size: 0402 (01005 inch) ultra-small chip components

• Maximum Component Size: 33.5mm × 33.5mm square standard components

• Maximum Component Height: 6mm (standard factory configuration)

• Applicable Components: Resistors, capacitors, inductors and all mainstream standard SMD chip components

4. PCB Board Specification

• Standard PCB Size (L Size): 410 × 360mm

• Optional Wide PCB Size (L-Wide): 510 × 360mm

• Extended Max PCB Size: Up to 800 × 560mm (custom configuration)

• PCB Transport Direction: Left to Right / Right to Left (adjustable)

• Transport Reference Side: Front side / Rear side (optional)

• PCB Transport Height: 900mm / 950mm (optional)

• Track Configuration: High-speed single-track conveyor, dual-track optional for enhanced productivity

5. Feeder Configuration

• Max Feeder Station Quantity: 240 stations (8mm dual-lane electronic tape feeder)

• Standard Feeder Capacity: 120 component types

• Compatible Feeder Types: High-speed electronic dual-lane tape feeders, mechanical tape feeders

• Feeder Feature: High-precision continuous feeding, hot-swap support, suitable for long-term uninterrupted mass production

6. Physical Dimension & Weight

• Machine Dimension (L×W×H): 2880 × 1650 × 1530mm

• Net Weight: Approximately 3750kg

7. Power & Air Supply

• Rated Power: 5.0KVA

• Power Supply: Three-phase AC 200V~415V, 50/60Hz

• Operating Air Pressure: 0.5±0.05MPa (dry, clean compressed air)

• Average Air Consumption: 350L/min (full-load working status)

8. Core Features & Advantages

• Dual-head modular high-speed design, realizing industry-leading 74,000 CPH ultra-high placement efficiency for chip components

• Massive 240 feeder stations with dual-lane feeding technology, supporting multi-type component simultaneous production

• High-speed on-the-fly laser recognition system, ensuring stable placement accuracy during high-speed continuous operation

• Ultra-high production stability, specially optimized for 24-hour uninterrupted high-volume standardized production scenarios

• Multiple PCB size compatibility, adapting from standard boards to large industrial PCBs

• Modular structural design, convenient maintenance and low long-term operating cost

9. Notes

• 1. 74,000 CPH theoretical maximum speed is tested under fully optimized standard conditions; actual production speed is restricted by component types and PCB layout

• 2. Extended wide PCB and ultra-large-size PCB processing functions require customized factory configuration and program calibration

• 3. This model is dedicated for high-speed chip mounting, not applicable for fine-pitch IC, BGA and large special-shaped component production

• 4. Dual-track transmission structure is an optional configuration for higher line throughput

• 5. All performance parameters comply with official JUKI factory standards and IPC9850 industry test specifications