Equipment name: used JUKI FX-2, refurbished JUKI FX-2 placement machine, used JUKI FX-2 smt placement machine

Company Introduction

Shenzhen Sonch(Sanzhu) Technology Co., Ltd. is a professional high-tech enterprise focusing on SMT and THT automation equipment. Founded in 2015, the company is located in Fuyong, Bao’an District, Shenzhen, adjacent to the Shenzhen World Exhibition & Convention Center. We benefit from Shenzhen’s complete electronic manufacturing industrial chain, mature international logistics and superior foreign trade policies.

We adopt a unique business model of Manufacturing + Trade + Global Service. Our business covers independent equipment R&D and production, new/used imported equipment agency sales, and full-range supporting spare parts supply. We provide one-stop turnkey solutions for electronic manufacturing factories worldwide.

Our product lineup covers the entire electronic production process, including SMT inspection equipment, soldering equipment, core placement and insertion machines, automated peripheral equipment, as well as various spare parts and consumables. We support OEM customization, non-standard equipment customization and full production line configuration.

After years of industrial accumulation, Sonch(Sanzhu) Technology has built a professional technical R&D team, standardized production system and global foreign trade service team. With stable equipment performance, strict quality control and flexible customization capabilities, we have established long-term cooperative relationships with customers and authorized distributors across Southeast Asia, South Asia, the Middle East and other global regions.

Focusing on quality and service, we are committed to providing cost-effective SMT automation equipment and reliable technical support for global electronic manufacturers, and strive to become a trusted long-term partner in the global intelligent manufacturing industry.

JUKI KE-2060 Official English Technical Parameters

1. Basic Machine Information

• Model: JUKI KE-2060 High Precision Universal Mounter

• Machine Type: Dual-head high-speed & high-precision general-purpose SMT placement machine

• Application: Mixed mass production of chip components, IC, BGA, QFP and irregular components, widely used in consumer electronics, industrial control and automotive electronic products

2. Placement Performance

• Chip Component Placement Speed: 12,500 CPH (laser recognition, optimal working condition)

• Standard IC Placement Speed: 1,850 CPH (vision recognition)

• Max IC Placement Speed (With MNVC Option): 3,400 CPH (multi-view vision camera)

• Placement Accuracy (Laser Recognition): ±0.05mm

• Placement Accuracy (Vision Recognition): ±0.03mm

• Placement Head Configuration: 1 × 4-nozzle laser head + 1 × 1-nozzle high-resolution vision head

• Component Recognition Mode: Laser alignment system + high-precision visual inspection system

3. Applicable Component Specifications

• Laser Recognition Component Range: 0603 (0201 inch) ~ 33.5mm square components

• Vision Recognition Component Range: 1.0×0.5mm ~ 74mm square components / max 50×150mm rectangular components

• Optional Ultra-small Component Support: 0402 (01005 inch) components (with dedicated optional module)

• Maximum Component Height: 6mm

• Total Component Types: Max 80 types (standard 8mm tape feeder configuration)

4. PCB Board Specification

• Supported PCB Sizes

￮ M Size: 330 × 250mm (standard)

￮ L Size: 410 × 360mm

￮ L-Wide Size: 510 × 360mm

￮ E Size: 510 × 460mm (extra-large board optional)

• PCB Transport Direction: Left to Right / Right to Left (adjustable)

• Transport Reference Side: Front side / Rear side (optional)

• PCB Transport Height: 900mm / 950mm (optional)

5. Feeder Configuration

• Max Feeder Station Quantity: 80 stations (8mm tape feeder standard)

• Compatible Feeder Types: Tape feeder, stick feeder, tray feeder (optional for IC/BGA components)

6. Physical Dimension & Weight

• Machine Dimension (L×W×H): 1400 × 1393 × 1440mm (M size configuration)

• Net Weight: 1410kg

7. Power & Air Supply

• Rated Power: 3KVA

• Power Supply: Three-phase AC 200V~415V, 50/60Hz

• Air Pressure Requirement: 0.5±0.05MPa (dry, clean compressed air)

8. Core Features & Advantages

• Dual-head collaborative design, balancing high speed and high precision placement

• Independent high-resolution vision head, stable placement for fine-pitch IC, BGA and QFP components

• Optional MNVC multi-view camera module greatly improves IC placement efficiency

• Wide component compatibility, supports ultra-small chips to large-size special-shaped components

• High operational stability, low maintenance cost, suitable for mixed SMT production lines

9. Notes

• 1. All CPH data refer to theoretical optimal speed; actual production speed is affected by component type, PCB layout and feeding scheme

• 2. 0402 (01005 inch) ultra-small component placement function requires official optional accessories and calibration

• 3. MNVC multi-view vision system is an optional accessory, which is necessary for high-efficiency mass production of IC components

• 4. Different PCB size configurations do not change the core placement accuracy and basic performance parameters