This 4-layer hybrid PCB is specifically engineered for high-performance electronic applications, integrating Rogers RO4350B and TG170 FR-4 materials. It leverages the superior electrical performance of RO4350B (close to PTFE/woven glass) and the reliable manufacturability of TG170 FR-4, making it ideal for multi-layer board constructions requiring stable signal transmission and excellent dimensional stability.

PCB Specification

PCB Stack-up

Rogers RO4350B Material Introduction

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/glass. RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.

This PCB combines RO4350B with TG170 FR-4 to further optimize the balance between performance and cost for 4-layer rigid board applications.

Key Material Features

Core Benefits

Ideal for Multi-layer Board (MLB) Constructions: The combined use of RO4350B and TG170 FR-4 is well-suited for 4-layer board designs, meeting complex circuit requirements.

Cost-Effective Fabrication: Processes like FR-4 at lower fabrication cost compared to conventional microwave laminates, reducing production expenses.

Excellent Dimensional Stability: RO4350B's CTE is similar to copper, ensuring superior dimensional stability even in harsh thermal environments.

Reliable Through-Hole Quality: Low Z-axis CTE of RO4350B provides reliable plated through-hole quality, suitable for severe thermal shock applications.

Competitive Pricing: Balances high performance with cost-effectiveness, offering competitive advantages in mass production.

Stable Thermal Performance: High Tg of RO4350B ensures stable expansion characteristics over the entire circuit processing temperature range.

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2 quality standards.

Availability: Worldwide supply is supported.

Typical Applications

-Telecom Infrastructure: Cellular Base Station Antennas and Power Amplifiers

-RF Identification: RF Identification Tags

-Automotive Electronics: Automotive Radar and Sensors

-Satellite Communication: LNB's (Low Noise Blocks) for Direct Broadcast Satellites

Summary

The 4-layer rigid PCB integrating Rogers RO4350B and TG170 FR-4 materials is a high-performance and cost-effective solution tailored for multi-layer board applications. Its global availability and competitive pricing make it a trusted choice for telecom, automotive, RFID, and satellite communication projects worldwide.