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Bicheng Electronics Technology Co., Ltd

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Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, high-frequency passive components, microstrip and stripline circuits, millimeter-wave equipment, radar systems, and digital RF antennas. The company’s high-frequency PCBs are primarily manufactured using three major high-frequency material brands: Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2. Headquartered in the economically vibrant city of Shenzhen, Bicheng PCB operates with a philosophy rooted in serving small and medium-sized enterprises, offering a wide variety of circuit boards to meet diverse market demands.

Main Business & PCB Applications

The company upholds the highest manufacturing standards to deliver products known for exceptional quality, performance, and reliability. In addition to high-frequency PCBs, Bicheng has divisions specializing in FR-4 circuit boards, flexible circuits, and metal-core PCBs, supporting everything from prototyping and small runs to mass production. The company actively develops value-added PCB solutions such as HDI, quick-turn production, impedance control, heavy copper, and backplane boards. This strategic focus enables Bicheng to offer an extended and complementary product range, forming an integrated line that spans from low-end to high-end PCBs. These circuit boards are widely used in home appliances, portable and consumer electronics, medical devices, aerospace, and telecommunications.

Main Material Partners

Basic Information

Company Name: Bicheng Electronics Technology Co., Ltd

Business Type: Manufacturer, Distributor/Wholesaler, Exporter, Seller

Brands: Bicheng

Employee Number: 350~450

Year Established: 2003

Total Sales Annual: 10 million-18 million

Company Location: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103

Factory Location: 1716 Shiyuan Zhongxin, Xinyi Road, Fuyong, Baoan, Shenzhen, Guangdong, China 518103

Trade & Market

Company slogan:

We Are Your RF PCB Solution Provider!

Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB

ISO9001, ISO14001, IATF 16949 certified

OEM Overview:

PCB Pattern Plating

Bicheng Electronics Technology Co., Ltd

PCB Washing

Bicheng Electronics Technology Co., Ltd

Developing

Bicheng Electronics Technology Co., Ltd

Production Line:

Bicheng Electronics Technology Co., Ltd

Bicheng Electronics operates two major production bases, strategically located in Shenzhen and Jiangmen.

The Shenzhen factory employs over 300 staff and has a monthly output exceeding 10,000 square meters of PCBs. As a brand-new facility, it specializes in quick-turn prototypes and small-volume production.

The Jiangmen factory features two new industrial buildings spanning approximately 15,000 square meters, specifically designed for mass production. Equipped with state-of-the-art automated machinery sourced from Israel, Japan, Germany, and Taiwan, the Jiangmen facility produces up to 30,000 square meters per month for 2- to 10-layer PCBs. The establishment of this plant has significantly strengthened Bicheng’s capacity to supply high-end PCBs to both domestic and global markets.

With a strong and diverse product portfolio, Bicheng serves customers worldwide. Our offerings include multi-layer boards (up to 32 layers), flex-rigid combinations, heavy copper PCBs, high-frequency and high-speed boards, and HDI, among other types.

We are committed to becoming a leading diversified PCB supplier known for precision-engineered products. Our mission is to create lasting value for our customers while building a promising future for our employees.

R&D:

Design For Manufacture

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume （S<100 m²）	Middle volume （S<10 m²）	Prototype（S<1m²）
			Large volume （S<100 m²）	Middle volume （S<10 m²）	Prototype（S<1m²）
1	Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.isolation of layers	0.1mm	0.1mm	0.06mm
2		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
3			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
4			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
5			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
6			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
7		Min.distance from drill to conductor	4 Layer 10mil，6 layer 10mil，8-12 layer 12mil	4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil	4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
8		Min.width of annular ring on inner layer	4 Layer 10mil（35um），≥6 Layer 14mil（35um）	4 Layer 8mil(35um)，≥6 layer 12mil（35um）	4 Layer 6mil（35um），≥6 Layer 10mil（35um）
9		Inner layer isolation ring width(Min)	10mil （35um）	8mil （35um）	6mil （35um）
10		Min.via pad diameter	20mil （35um）	16mil （35um）	16mil （35um）
11		Min. distance from board edge to conductor(no copper exposured)(inner layer)	14 mil（35um）	12 mil（35um））	8 mil（35um）
12		Maximum copper weight(Inner layer and outer layer)	3 OZ( 105 um )	4 OZ ( 140 um )	6 OZ( 210 um )
13		Core with different copper foil on both sides	/	18/35,35/70 um	18/35,35/70 um
14	Laminating	Tolerance of laminate thickness	±10% PCB thick	±10% PCB thick	±8% PCB thick
15		Maximum laminate thickness	4.0mm	6.0mm	7.0mm
16		Laminate alignment accuracy	≤±5 mil	≤±4 mil	≤±4 mil
17	Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.drill bit diameter	0.2 mm	0.2 mm	0.2 mm
18		Min.slot router diameter	0.60 mm	0.60 mm	0.60 mm
19		Min.tolerance of PTH slots	±0.15mm	±0.15mm	±0.1mm
20		Max.aspect ratio	1:08	1:12	1:12
21		Hole tolerance	±3mil	±3mil	±3mil
22		Space of via to via	6mil(same net)，12mil(different net)	6mil(same net)，14mil(different net)	4mil(same net)，12mil(different net)
23		Space of component hole to component hole	12mil(same net)，16mil(different net)	12mil(same net)，16mil(different net)	10mil(same net)，14mil(different net)
24	Etching	Min.width of etching logo	10mil(18um)，12 mil (35um)，12 mil(70um）	8mil(18um)，10mil(35um)，12 mil(70um）	6mil(18um)，8 mil(35um)，12mil(70um）
25	Etching	Etch factor	1.6-2.2	1.6-2.2	1.6-2.2
26	Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.via pad diameter	20mil	16mil	16mil
27		Min.BGA pad diameter	12mil	12mil	10mil
28		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
29		Minimum grid	10/10mil(35um)	8/8mil(35um)	4/8mil(35um)
30		Min.space (conductor to pad, pad to pad)	6mil(18um)	5mil(18um)	4mil(18um)
			6mil(35um)	5mil(35um)	4mil(35um)
			9mil(70um)	8mil(70um)	7mil(70um)
			11mil(105um)	10mil(105um)	9mil(105um)
			13mil(140um)	12mil(140um)	11mil(140um)
31	Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Maximum via-plug diameter	0.5mm	0.5mm	0.5mm
32		Min.width of solder mask bridge	Green:5mil（35um）	Green:4mil（35um）	Green:4mil（35um）
33			Yellow：5mil（35um）	Yellow：4mil（35um）	Yellow：4mil（35um）
34			Blue：5mil（35um）	Blue：4mil（35um）	Blue：4mil（35um）
35			Black：6mil（35um）	Black：6mil（35um）	Black：6mil（35um）
36			White:6mil（35um）	White:6mil（35um）	White:6mil（35um）
37			All of Matt：6mil	All of Matt：6mil	All of Matt：6mil
38			Green:5mil（70um）	Green:4mil（70um）	Green:4mil（70um）
39			Yellow：5mil（70um）	Yellow：4mil（70um）	Yellow：4mil（70um）
40			Blue：5mil（70um）	Blue：4mil（70um）	Blue：4mil（70um）
41			Black：6mil（70um）	Black：6mil（70um）	Black：6mil（70um）
42			White:6mil（70um）	White:6mil（70um）	White:6mil（70um）
43		Open solder mask	4mil(35um)	4mil(35um)	3mil(35um)
44		Solder mask coverage	4mil(35um)	4mil(35um)	3mil(35um)
45		Min.width of solder mask text	9mil(35um)	9mil(35um)	8mil(35um)
46		Min.thickness of Solder mask	9um(35um)	9um(35um)	9um(35um)
47		Max.thickness of solder mask	30um(35um)	30um(35um)	30um(35um)
48	Silkscreen	Min.width of silkscreen text	6mil	6mil	5mil
49		Min.height of silkscreen text	35mil	35mil	30mil
50		Min.space from silkscreen to pads	6mil	6mil	5mil
51		Colour of silkscreen	White, Black, Yellow
52	Carbon ink	Carbon ink covers conductor or pads	14mil	13mil	12mil
53	Carbon ink	Mid distance from carbon ink to pads	12mil	11mil	10mil
54	Peelable mask	Peelable mask covers conductor or pads	8mil	7mil	6mil
55		Min.distance from peelable mask to pads	14mil	13mil	12mil
56		Max.via-plug of Silk-screen method	2.0mm	2.0mm	2.0mm
57		Max. via-plug of aluminum foil method	4.5mm	4.5mm	4.5mm
58	Surface finish	Thickness of nickel of ENIG	3-5um	3-5um	2-6.35um
59		Thickness of Gold of ENIG	0.05-0.1um
60		Thickness of nickel of Gold finger	3-5um
61		Thickness of Gold of Gold finger	0.1-1.27um
62		Thickness of tin of HASL	2.54-6.35um
63		Thickness of OSP	0.2-0.5um
64		Thickness of tin of Immersion tin	0.2-0.75um
65		Thickness of silver of Immersion silver	0.15-0.75um
66	Contour process	Method of contour process	CNC milling, V-CUT, Break-out tap, break-out holes, Punching
67		Minimum router	0.8mm
68		Min.tolerance of contour	±0.15mm	±0.13mm	±0.1mm
69		Min.distance of milling contour(no copper exposure)	12mil	10mil	8mil
70		Angle of V-CUT	20、30、45、60 ±5 degree
71		Degree of symmetry of V-CUT	±6mil	±5mil	±4mil
72		Tolerance of residual thickness of V-CUT	±6mil	±5mil	±4mil
73		Tolerance of Chamfer angle of Gold finger	±5 degree	±5 degree	±5 degree
74		Tolerance of residual thickness of bevel edge of gold finger	±5mil	±5mil	±5mil
75		Min radius of inner corner	0.4mm
76		Min. distance from edge to V-Cut (no copper exposure)	18mil (1.6mm Thick, 20 degree V-groove cutter)	14mil(1.6mm Thick, 20 degree V-groove cutter)	12mil (1.6mm Thick, 20 degree V-groove cutter)
77			20mil (1.6mm Thick, 30 degree V-groove cutter)	18mil (1.6mm Thick, 30 degree V-groove cutter)	16mil (1.6mm Thick, 30 degree V-groove cutter)
78			24mil (1.6mm Thick, 45 degree V-groove cutter)	22mil (1.6mm Thick, 45 degree V-groove cutter)	20mil (1.6mm Thick, 45 degree V-groove cutter)
79			30mil (1.6mm Thick, 60 degree V-groove cutter)	28mil (1.6mm Thick, 60 degree V-groove cutter)	26mil (1.6mm Thick, 60 degree V-groove cutter)
80	Special tolerance	Board thickness of flying probe test	0.6-4.0mm
81		Panel size of flying probe test	Size≤900X600mm, Small size can be compensated through manufacturing procedure
82		Panel size of fixture test method	Size≤460X380mm, Small size can be compensated through manufacturing procedure
83		Board thickness of fixture test method	0.4-6.0mm
84		Tolerance of press-fit hole	±2mil
85		Tolerance of NPTH	±2mil
86		Tolerance of PCB thickness	1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10%
87		Tolerance of depth of countersunk hole	±0.2mm
88		Depth tolerance of blind slot	±0.2mm
89		Maximum shipment size	Size≤1200X600mm（Double side, no test required）
90		Maximum shipment size	Size≤1000X600mm（ Multilayer, no test required）
91		Minimum shipment size	10X10mm
92		PCB thickness of HASL	0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent )
93		HASL PCB Size	Size≤600X460mm
94		PCB thickness	0.15-7.0mm
95		Depth of V groove	0.8-3.2mm
96		Distance of non-continuous v-groove	≥7mm
97		Max. drill diameter	Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ）
98		Max. countersink diameter	Size≤6.5mm Countersink can be used counterbore drill or router）
99		Distance of Bevel	Size≥11mm	Size≥5mm	Size≥5mm
100		Thickness of peelable mask	0.2-1.5mm ±0.15mm

Our Team:

Bicheng Electronics Technology Co., Ltd

Every day, we dedicate to make things better, keep moving forward and never stop. We believe that teamwork is the guarantee of success, and our focus on creative process makes us even better.

Under the guidance of modern science management and instant information shared through the network technology, a high efficient working environment has been come into being. Skilled manufacturing experience can bring out the best performance of the equipment. You'll enjoy our professional super-value services with our high quality PCB's and flexible cooperation.

Your individual requirements can get satisfied at Bicheng and also our success can be achieved by the innovative products and competitive advantages.

History:

BichengPCB is the brand of Shenzhen Bicheng Electronics Technology Co., Ltd. It can be traced back to 2003 when her name is Bicheng Enterprise Company. It specialized in blank printed circuit boards for single sided PCB and double sided PCB.

In order to meet the increases of market demands, we started to offer multilayer PCBs in 2008, layer count up to 32 layers. Bicheng introduced high frequency material in 2010 for the applications of antenna and amplifer and raido products.

With development, metal core PCB and hybrid PCB were suscessfully put into trial production and and got highly evaluated. In 2014 the company was restructured and reformed. Bicheng played a new role in the organiztion, focusing on global market sales and after-sales services.

Time flies to 2020, we have completed a series of integrated PCB products: High frequency/microwave PCB, Multi-layer/ Hybrid PCB, Metal Core PCB and Flexible Circuits.

As of now, our products can be found in more than 100 countries and regions in the world.

Bicheng Electronics Technology Co., Ltd

office building

Service:

Bicheng Electronics Technology Co., Ltd

PCB Test

·Automatic Optical Inspection
·Differential Impedance / Single End Impedance
·Flying Probe Net List Test
·High Voltage Test
·IPC Class 2 / IPC Class 3
·Reliability Test
·Solder-ability Test
·Thermal Stress Test
·TDR Testing

Available Base Materials

·RO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210;
·RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC;
·TMM4, TMM10, Kappa 438;
·TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5;
·PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2);
·AD450, AD600, TC350;
·Nelco N4000, N9350, N9240;
FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V;
Polyimide, PET;
Aluminum base, Copper base
·Hybrid PCB

Plating

·Conductive Via Fill
·Hard Gold Edge connector
·HASL Standard
·HASL Lead Free (RoHS)
·Immersion Gold
·Immersion Silver
·Immersion Tin
·Non-Conductive Via Fill
·OSP
·Plated Edges
·Plated Radii (Castellation)
·Plated Milling Cutouts
·Non-Conductive Via Fill

PRODUCT CATEGORIES

RF PCB Board

Rogers PCB Board

Taconic PCB

PTFE PCB Board

F4B PCB

Multilayer PCB

Hybrid PCB

HDI PCB Board

High Speed PCB

FR 4 PCB Board

Custom PCBs

Bicheng Electronics Technology Co., Ltd

Profile

Basic Information

Trade & Market