Bicheng Electronics Technology Co., Ltd
Verified Supplier
6 Years
guangdong, shenzhen
Since 2003
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Bicheng Electronics Technology Co., Ltd

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Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
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Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd
Bicheng Electronics Technology Co., Ltd

Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communications, high-frequency passive components, microstrip and stripline circuits, millimeter-wave equipment, radar systems, and digital RF antennas. Bicheng's high-frequency PCBs are primarily manufactured using three major high-frequency material brands—Rogers Corporation, Taconic, and Wangling—with dielectric constants ranging from 2.2 to 10.2. Headquartered in the economically vibrant city of Shenzhen, Bicheng PCB operates with a philosophy centered on serving small and medium-sized enterprises, offering a wide variety of circuit boards to meet diverse market demands.

Main Business & PCB Applications

The company upholds the highest manufacturing standards to deliver products known for exceptional quality, performance, and reliability. In addition to high-frequency PCBs, Bicheng has divisions specializing in FR-4 circuit boards, high frequency PCBs, and RF PCBs, supporting everything from prototyping and small-batch production to mass manufacturing. The company actively develops value-added PCB solutions, including HDI, quick-turn production, impedance control, heavy copper, and backplane boards. This strategic focus enables Bicheng to offer an extended and complementary product range, forming an integrated line that spans from low-end to high-end PCBs. These circuit boards are widely used in home appliances, portable and consumer electronics, medical devices, aerospace, and telecommunications.

Main Material Partners

Basic Information

Company Name: Bicheng Electronics Technology Co., Ltd
Business Type: Manufacturer, Distributor/Wholesaler, Exporter, Seller
Brands: Bicheng
Employee Number: 350~450
Year Established: 2003
Total Sales Annual: 10 million-18 million
Company Location: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Factory Location: 1716 Shiyuan Zhongxin, Xinyi Road, Fuyong, Baoan, Shenzhen, Guangdong, China 518103

Trade & Market

Company slogan:

We Are Your RF PCB Solution Provider!

Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB

ISO9001, ISO14001, IATF 16949 certified

OEM Overview:

About Us

We are a service-oriented company specializing in PCB fabrication and PCBA delivery. Our core team has over 20 years of industry experience, with in-depth knowledge of manufacturing processes for multi-layer PCBs, HDI boards, rigid-flex boards, high-frequency and high-speed boards.

We do not provide PCB design services. Our expertise lies in efficiently and reliably transforming customer-provided design files (Gerber, BOM, pick-and-place files, etc.) into manufacturable, high-quality products.

Our Services

OEM Manufacturing

With complete design files provided by customers, we manage the entire PCB fabrication and PCBA process:

DFM Review: Engineering validation of Gerber files before production—checking trace width and spacing, hole sizes, stack-up structure, impedance control, and other critical parameters to identify and resolve manufacturing risks early.

Production Resource Matching: Optimal production line allocation based on layer count, material type (FR4, high-frequency materials, metal-core, etc.), surface finish requirements (ENIG, OSP, HASL, etc.), and delivery schedule.

End-to-End Quality Control: Full-process monitoring from material cutting, lamination, drilling, and plating to solder mask, surface finishing, profiling, and electrical testing. Mandatory inspection hold points at critical stages, with 100% electrical testing on finished boards.

PCBA Assembly: Component sourcing, SMT placement, DIP insertion, AOI inspection, X-Ray inspection, ICT testing, functional testing (per customer requirements), assembly, and packaging.

Supply Chain Integration

Leveraging long-established supply chain partnerships, we offer:

Component Sourcing: BOM kitting services through reliable component channels, reducing customers' administrative costs of fragmented procurement.

Flexible Capacity Coordination: Agile capacity deployment across multiple manufacturing partners based on order volume, process complexity, and delivery urgency to ensure on-time delivery.

Cost Optimization Recommendations: Reference suggestions on material alternatives, panelization optimization, and surface finish selection to reduce costs without altering the original design.

Quality System

All manufacturing partners are certified with:

  • ISO 9001 Quality Management System
  • IATF 16949 Automotive Quality Management
  • ISO 13485 Medical Devices Quality Management
  • UL Safety Certification

All products are RoHS and REACH compliant.

Each shipment includes a complete inspection report (impedance test, solderability test, cross-section analysis, etc.) with full traceability.

PCB Pattern Plating

Bicheng Electronics Technology Co., Ltd

PCB Washing

Bicheng Electronics Technology Co., Ltd

Developing

Bicheng Electronics Technology Co., Ltd

Production Line:

Bicheng Electronics Technology Co., Ltd

Bicheng Electronics operates two major production bases, strategically located in Shenzhen and Jiangmen.

The Shenzhen factory employs over 300 staff and has a monthly output exceeding 10,000 square meters of PCBs. As a brand-new facility, it specializes in quick-turn prototypes and small-volume production.

The Jiangmen factory features two new industrial buildings spanning approximately 15,000 square meters, specifically designed for mass production. Equipped with state-of-the-art automated machinery sourced from Israel, Japan, Germany, and Taiwan, the Jiangmen facility produces up to 30,000 square meters per month for 2- to 10-layer PCBs. The establishment of this plant has significantly strengthened Bicheng’s capacity to supply high-end PCBs to both domestic and global markets.

With a strong and diverse product portfolio, Bicheng serves customers worldwide. Our offerings include multi-layer boards (up to 32 layers), flex-rigid combinations, heavy copper PCBs, high-frequency and high-speed boards, and HDI, among other types.

We are committed to becoming a leading diversified PCB supplier known for precision-engineered products. Our mission is to create lasting value for our customers while building a promising future for our employees.

R&D:

Design For Manufacture

Serial NO. Procedure Item Manufacturing capability
Large volume S<100 m² Middle volume S<10 m² PrototypeS<1m²
1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil6 layer 8mil8-12 layer 10mil14-20 layer 14mil22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
9 Inner layer isolation ring width(Min) 10mil (35um) 8mil (35um) 6mil (35um)
10 Min.via pad diameter 20mil (35um) 16mil (35um) 16mil (35um)
11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil(35um) 12 mil(35um)) 8 mil(35um)
12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um ) 4 OZ ( 140 um ) 6 OZ( 210 um )
13 Core with different copper foil on both sides / 18/35,35/70 um 18/35,35/70 um
14 Laminating Tolerance of laminate thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
15 Maximum laminate thickness 4.0mm 6.0mm 7.0mm
16 Laminate alignment accuracy ≤±5 mil ≤±4 mil ≤±4 mil
17 Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.drill bit diameter 0.2 mm 0.2 mm 0.2 mm
18 Min.slot router diameter 0.60 mm 0.60 mm 0.60 mm
19 Min.tolerance of PTH slots ±0.15mm ±0.15mm ±0.1mm
20 Max.aspect ratio 1:08 1:12 1:12
21 Hole tolerance ±3mil ±3mil ±3mil
22 Space of via to via 6mil(same net),12mil(different net) 6mil(same net),14mil(different net) 4mil(same net),12mil(different net)
23 Space of component hole to component hole 12mil(same net),16mil(different net) 12mil(same net),16mil(different net) 10mil(same net),14mil(different net)
24 Etching Min.width of etching logo 10mil(18um),12 mil (35um),12 mil(70um) 8mil(18um),10mil(35um),12 mil(70um) 6mil(18um),8 mil(35um),12mil(70um)
25 Etch factor 1.6-2.2 1.6-2.2 1.6-2.2
26 Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.via pad diameter 20mil 16mil 16mil
27 Min.BGA pad diameter 12mil 12mil 10mil
28 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
29 Minimum grid 10/10mil(35um) 8/8mil(35um) 4/8mil(35um)
30 Min.space (conductor to pad, pad to pad) 6mil(18um) 5mil(18um) 4mil(18um)
6mil(35um) 5mil(35um) 4mil(35um)
9mil(70um) 8mil(70um) 7mil(70um)
11mil(105um) 10mil(105um) 9mil(105um)
13mil(140um) 12mil(140um) 11mil(140um)
31 Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.5mm 0.5mm 0.5mm
32 Min.width of solder mask bridge Green:5mil(35um) Green:4mil(35um) Green:4mil(35um)
33 Yellow:5mil(35um) Yellow:4mil(35um) Yellow:4mil(35um)
34 Blue:5mil(35um) Blue:4mil(35um) Blue:4mil(35um)
35 Black:6mil(35um) Black:6mil(35um) Black:6mil(35um)
36 White:6mil(35um) White:6mil(35um) White:6mil(35um)
37 All of Matt:6mil All of Matt:6mil All of Matt:6mil
38 Green:5mil(70um) Green:4mil(70um) Green:4mil(70um)
39 Yellow:5mil(70um) Yellow:4mil(70um) Yellow:4mil(70um)
40 Blue:5mil(70um) Blue:4mil(70um) Blue:4mil(70um)
41 Black:6mil(70um) Black:6mil(70um) Black:6mil(70um)
42 White:6mil(70um) White:6mil(70um) White:6mil(70um)
43 Open solder mask 4mil(35um) 4mil(35um) 3mil(35um)
44 Solder mask coverage 4mil(35um) 4mil(35um) 3mil(35um)
45 Min.width of solder mask text 9mil(35um) 9mil(35um) 8mil(35um)
46 Min.thickness of Solder mask 9um(35um) 9um(35um) 9um(35um)
47 Max.thickness of solder mask 30um(35um) 30um(35um) 30um(35um)
48 Silkscreen Min.width of silkscreen text 6mil 6mil 5mil
49 Min.height of silkscreen text 35mil 35mil 30mil
50 Min.space from silkscreen to pads 6mil 6mil 5mil
51 Colour of silkscreen White, Black, Yellow
52 Carbon ink Carbon ink covers conductor or pads 14mil 13mil 12mil
53 Mid distance from carbon ink to pads 12mil 11mil
Our Team:

Bicheng Electronics Technology Co., Ltd

Every day, we strive to improve, keep progressing, and never stand still. We believe that teamwork is the key to success, and our commitment to the creative process only makes us stronger.

Guided by modern scientific management and real-time information sharing through network technology, we have created a highly efficient working environment. Our skilled manufacturing expertise helps equipment achieve its best performance. With our high-quality PCBs and flexible cooperation, you will experience professional, value-added service.

At Bicheng, your specific needs are met, while our success is driven by innovative products and a competitive edge.

History:

BichengPCB is the brand of Shenzhen Bicheng Electronics Technology Co., Ltd. Its origins date back to 2003, when it was known as Bicheng Enterprise Company, specializing in blank printed circuit boards for single-sided and double-sided PCBs.

To meet growing market demand, the company began offering multilayer PCBs in 2008, with layer counts reaching up to 32 layers. In 2010, Bicheng introduced high-frequency materials for applications involving antennas, amplifiers, and radio products.

As the company evolved, metal-core PCBs and hybrid PCBs were successfully trialed and received high praise. In 2014, the company underwent restructuring and reform, with Bicheng taking on a new role within the organization—focusing on global market sales and after-sales services.

By 2020, Bicheng had completed a full range of integrated PCB products, including high-frequency/microwave PCBs, multi-layer/hybrid PCBs, metal-core PCBs, and flexible circuits.

Today, Bicheng’s products can be found in over 100 countries and regions around the world.

Bicheng Electronics Technology Co., Ltd

office building

Service:

Bicheng Electronics Technology Co., Ltd

PCB Test

  • ·Automatic Optical Inspection
  • ·Differential Impedance / Single End Impedance
  • ·Flying Probe Net List Test
  • ·High Voltage Test
  • ·IPC Class 2 / IPC Class 3
  • ·Reliability Test
  • ·Solder-ability Test
  • ·Thermal Stress Test
  • ·TDR Testing

Available Base Materials

  • ·RO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210;
  • ·RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC;
  • ·TMM4, TMM10, Kappa 438;
  • ·TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5;
  • ·PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2);
  • ·AD450, AD600, TC350;
  • ·Nelco N4000, N9350, N9240;
  • FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V;
  • Polyimide, PET;
  • Aluminum base, Copper base
  • ·Hybrid PCB

Plating

  • ·Conductive Via Fill
  • ·Hard Gold Edge connector
  • ·HASL Standard
  • ·HASL Lead Free (RoHS)
  • ·Immersion Gold
  • ·Immersion Silver
  • ·Immersion Tin
  • ·Non-Conductive Via Fill
  • ·OSP
  • ·Plated Edges
  • ·Plated Radii (Castellation)
  • ·Plated Milling Cutouts
  • ·Non-Conductive Via Fill
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