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Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Specifications
Abrasive Material :
Diamond
Packaging Details :
Shine Abrasives color box with shock-proof foam insert, export-grade corrugated carton
Wheel Bore :
31.75mm
Coolant Compatibility :
Water-based & Oil-based
Brand Name :
Shine Abrasives
Application :
Technical Ceramic & Semiconductor Wafer Grinding
MOQ :
2 Pieces
Concentration :
125%
Payment Terms :
T/T,L/C,PayPal,Western Union
Bond Type :
Hybrid (Resin + Metal)
Wheel Diameter :
150mm / 6 inch
Model Number :
11V9-150
Supply Ability :
1000 Pieces per Month
Certification :
ISO 9001:2015
Price :
USD 70-180 / Piece
Delivery Time :
7-15 working days after deposit
Core Material :
Aluminum / Steel
HS Code :
6804211000
Shape :
11V9
Place of Origin :
Guangdong, China
Grit Size :
D46
Description

Hybrid Bond Diamond CNC Grinding Wheel for Technical Ceramics & Wafers

Designed for precision grinding of technical ceramics, silicon carbide and semiconductor components. The 11V9 hybrid bond diamond wheel combines the cool, free cutting of resin with the form-holding stability of metal bond, controlling heat and subsurface damage.

Key Advantages

  • Cool cutting for ceramics, silicon carbide and metal-ceramic composites
  • Excellent precision at high feed rates with minimal chipping
  • Maintains form and edge quality over long cycles
  • Suitable for water-based and oil-based coolant systems

Specifications

Bond TypeHybrid (Resin + Metal)
Shape11V9
Diameter150mm / 6 inch
Bore31.75mm
Grit SizeD46
Concentration125%
Core MaterialAluminum / Steel

Applications

Technical ceramic and advanced ceramic grinding, silicon carbide components, semiconductor wafer edge and surface grinding, metal-ceramic composite machining.

Sizes and bond formulations can be customized. Contact us for a quote.

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Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding

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Product Detail
Abrasive Material :
Diamond
Packaging Details :
Shine Abrasives color box with shock-proof foam insert, export-grade corrugated carton
Wheel Bore :
31.75mm
Coolant Compatibility :
Water-based & Oil-based
Brand Name :
Shine Abrasives
Application :
Technical Ceramic & Semiconductor Wafer Grinding
Contact Supplier
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding

ZHENGZHOU SHINE ABRASIVES CO.,LTD

Verified Supplier
5 Years
henan, zhengzhou
Since 2008
Business Type :
Manufacturer, Importer, Exporter
Main Products :
Resin Bond Diamond Wheels, 1A1 Diamond Wheel, CBN Sharpening Wheel
Employee Number :
51~100
Certification Level :
Verified Supplier
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