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0.2mm-10mm PCB Circuit Board BGA Assembly 14 Layer For Industrial Control
0.2mm-10mm PCB Circuit Board BGA Assembly 14 Layer For Industrial Control
Specifications
Certification :
ISO, UL, IPC, Reach
Place of Origin :
China
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Delivery Time :
5-30 days
Layer :
14 Layer
Material :
FR4
Board Thickness :
0.2-10mm
Surface Finish :
ENIG/Immersion Gold/HASL
Pin Space :
0.25mm
Application :
Industrial Control
Description

BGA Circuit Board Assembly for Industrial Control

♦ What Is BGA Assembly?

BGA (Ball Grid Array) assembly​​ is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath the package, allowing for:

    • ​​Higher density connections​​ (more I/O in a smaller space)
    • ​​Better electrical & thermal performance​​ (shorter signal paths, improved heat dissipation)
    • ​​Reduced risk of bent or damaged pins​​ (since there are no leads)

♦ Key Features of Contract Manufacturing:

    1. ​​Solder Paste Application​​ – A stencil deposits solder paste onto PCB pads.
    2. ​​BGA Placement​​ – A pick-and-place machine positions the BGA component accurately.
    3. ​​Reflow Soldering​​ – The PCB is heated in a reflow oven, melting the solder balls to form connections.
    4. ​​Inspection & Testing​​ – X-ray inspection (AXI) checks for alignment and solder joint quality.

​​♦ Common Challenges in BGA Assembly:

    • ​​Solder joint defects​​ (voids, bridging, cold joints)
    • ​​Difficulty in rework/repair​​ (due to hidden solder joints)
    • ​​Thermal management​​ (BGAs can generate heat, requiring proper PCB design)

♦ Technical Parameters

PCB Assembly Capability

Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L＜2mm

Maximum

L≤800mm, W≤460mm

L ＞ 1200mm, W＞500mm

Thickness( T)

Thinnest

0.2mm

T＜0.1mm

Thickest

4 mm

T＞4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm＜T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch＜0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch＜0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L＜50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T＜0.8mm

Thickest

3.5mm

T＞2mm

♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

Would you like details on ​​BGA rework​​ or ​​inspection techniques​​?

Contact us via email : sales@dqspcba.com

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0.2mm-10mm PCB Circuit Board BGA Assembly 14 Layer For Industrial Control

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Product Detail
Certification :
ISO, UL, IPC, Reach
Place of Origin :
China
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Delivery Time :
5-30 days
Contact Supplier
0.2mm-10mm PCB Circuit Board BGA Assembly 14 Layer For Industrial Control

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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