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High Quality Mobile Phone PCB Production
High Quality Mobile Phone PCB Production
Specifications
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Layer :
1-64 Layer
Base Material :
Fr4
Thickness :
0.5-10mm
Copper Thickness :
0.5-100Z
Board Size :
Customized
Min. Line Width/Space :
0.10/0.10mm
Surface Treatment :
ENIG/Immersion Gold
Certificate :
UL,IATF16949,ISO&Reach
Description

High Quality Mobile Phone PCB Production



♦ What's Mobile Phone PCB Production?


Mobile Phone PCB Production is the process of designing and fabricating the printed circuit boards (PCBs) that serve as the backbone of smartphones. It involves several key stages:


1. Design & Layout: Engineers use specialized software to create a multi-layer schematic that positions components like the processor, memory, and antennas for optimal performance and minimal space usage.


2. Material Selection: High-performance substrates (e.g., FR-4, polyimide, or advanced low-loss laminates) are chosen based on electrical, thermal, and mechanical requirements, especially for 5G and high-speed signals.


3. Fabrication:

  • A copper-clad laminate is drilled and etched to form fine traces and vias.
  • Multiple layers are stacked and bonded to create a compact multilayer board.
  • Surface finishes (ENIG, OSP, etc.) are applied to protect copper and enable soldering.

4. Assembly: Surface-Mount Technology (SMT) places and solders tiny components; through-hole parts are added if needed. Automated optical and X-ray inspections ensure joint quality.


5. Testing & Integration: Electrical tests, signal-integrity checks, and thermal cycling verify reliability before the PCB is integrated into the phone chassis.




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♦ Technical Parameters


Item

Specification

Laers

1~64

Board thickness

0.1mm-10.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-15 OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.




♦ One-Stop PCBs Solution


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♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines


2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%


3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production


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High Quality Mobile Phone PCB Production

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Product Detail
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Layer :
1-64 Layer
Base Material :
Fr4
Thickness :
0.5-10mm
Contact Supplier
High Quality Mobile Phone PCB Production

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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