High Quality and High Efficiency PCB Laser Cutting Machine designed specifically for SMT (Surface Mount Technology) production lines, delivering precision cutting with exceptional performance.
Application
- Cutting various flexible circuit board materials and cover film with clean, carbonization-free results
- High-quality, high-speed cutting of rigid materials up to 1mm (0.04") thickness
- UV light processing through decomposition and vaporization minimizes burrs
- Minimal thermal effect prevents stratification; produces precise, smooth cutting edges with steep sidewalls
- Capable of cutting various substrate materials including silicon, ceramics, and glass
- Precision etching forming of various functional films
- Efficient FPC/PCB cutting, drilling, window covering, fingerprint identification chip cutting, TF memory card sub-boards, and mobile phone camera module cutting applications
YSV-7A Product Features
- Neat, smooth edges after cutting with no burrs, dust, or particle residue
- High precision cutting, especially effective for small arcs and fine cutting applications
- Significantly reduces molding failure rates
- Single-pass cutting capability for composite workpieces with multiple materials and varying thicknesses
- Automatic laser head height adjustment for easy handling of double-sided surface-mounted FPC
Basic Specifications and Technical Parameters
| Specification/Model | YSV-7A |
| Laser Head | SP (USA) |
| Laser Wavelength | 355nm light wave UV laser |
| Max Power | 10W / 15W / 17W |
| Worktable Location Precision | ±0.003mm |
| Worktable Repetition Precision | ±0.002mm |