Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards
PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision

Laser Depanelizer Machine,YSATM-3L Feature:
1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
3. Reduce energy consumption, Cost savings.
4. Cost-effective, fast cutting speed, stable performance
5.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
Laser Depanelizer Machine, YSATM-3L Specification:
| Parameter |
| |
|
Technical parameters | Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of the | 1500Kg | |
| Power | AC220 V | |
| Laser | 355 nm | |
| Laser |
Optowave 10W(US) | |
| Material | ≤1.2 mm | |
| Precisio | ±20 μm | |
| Platfor | ±2 μm | |
| Platform | ±2 μm | |
| Working area | 600*450 mm | |
| Maximum | 3 KW | |
| Vibrating | CTI(US) | |
| Power | AC220 V | |
| Diameter | 20±5 μm | |
| Ambient | 20±2 ℃ | |
| Ambient | <60 % | |
| The Machine | Marble | |
Laser Depanelizer Machine Principle
