
Different applications demand different substrate materials—FR4 for general-purpose, aluminum for thermal management, Rogers for high-frequency, and many more. Studio Electronics offers PCB Fabrication on a wide range of materials—FR4, CEM, High-TG, Halogen-Free, Aluminum Base, Copper Base, Ceramic Base, Rogers, and specialty resin materials. As a comprehensive provider of PCB assembly in China, we help you select the optimal material for your application and fabricate boards to your exact specifications. Our complete turnkey service covers material procurement through fabrication, assembly, and shipping.
| Material | Properties | Applications | Quality Control |
|---|---|---|---|
| FR4 | Flame-retardant; epoxy glass; cost-effective | General-purpose; consumer electronics | Material certification; incoming inspection |
| CEM-1 | Composite; cost-effective; single-sided | Simple circuits; low-cost applications | Material certification; thickness measurement |
| CEM-3 | Composite; double-sided; moderate density | Double-sided applications | Material certification; dimensional verification |
| High-TG FR4 | High glass transition temperature; lead-free compatible | Lead-free soldering; high-temperature | TG verification; material certification |
| Halogen-Free | Environmentally friendly; low smoke | Environmental compliance applications | Compliance verification; material tracking |
| Aluminum Base | Excellent thermal conductivity | LED lighting; power applications | Thermal performance verification |
| Copper Base | Superior thermal conductivity | High-power applications | Thermal performance verification |
| Ceramic Base | High thermal conductivity; excellent insulation | High-frequency; high-power | Material certification; thermal verification |
| Rogers | Low dielectric loss; consistent DK | High-frequency; RF/microwave | Material certification; DK verification |
| Specialty Resin | Unique properties for specific applications | Specialized applications | Material certification; specification compliance |

ENIG – Applicable to all materials; excellent solderability; fine-pitch compatible
HASL – Applicable to FR4, CEM; cost-effective; good solderability
OSP – Applicable to all materials; cost-effective; flat surface
Immersion Silver – Applicable to all materials; high-frequency; flat surface
Immersion Tin – Applicable to FR4, CEM; flat surface; press-fit
Gold Plating – Applicable to all materials; excellent durability; wire bonding

| Material | Single-Sided | Double-Sided | Multi-Layer | Flexible | Rigid-Flex |
|---|---|---|---|---|---|
| FR4 | ✔ | ✔ | ✔ (3-20 layers) | — | ✔ |
| CEM-1 | ✔ | — | — | — | — |
| CEM-3 | ✔ | ✔ | ✔ (3-10 layers) | — | — |
| High-TG | ✔ | ✔ | ✔ (3-20 layers) | — | ✔ |
| Halogen-Free | ✔ | ✔ | ✔ (3-20 layers) | — | ✔ |
| Aluminum | ✔ | ✔ | ✔ (3-10 layers) | — | — |
| Copper | ✔ | — | — | — | — |
| Ceramic | ✔ | ✔ | ✔ (3-10 layers) | — | — |
| Rogers | ✔ | ✔ | ✔ (3-20 layers) | — | — |
| Polyimide | ✔ | ✔ | ✔ (3-10 layers) | ✔ | ✔ |

Performance – Different materials optimize different performance attributes
Reliability – Material properties affect long-term reliability
Cost – Material selection impacts overall cost
Application Fit – Choose the right material for your specific application
Studio delivers PCB Fabrication on FR4, Aluminum, Rogers, and more—the right material for your application.