Overview

As electronic devices become increasingly complex, multi-layer PCBs have become essential for high-density interconnect applications. Studio Electronics delivers Multi-Layer PCB Fabrication with capability up to 20 layers, serving industries from telecommunications and automotive to medical devices and industrial controls. As a premier provider of PCB assembly in China, we combine advanced fabrication technology with rigorous quality control to produce multi-layer boards that meet the most demanding specifications. From material selection through layer alignment, lamination, drilling, and surface finishing, every step is precisely controlled to ensure signal integrity and reliability. Our complete turnkey service covers everything from component sourcing through PCB fabrication, assembly, and final shipping.

Multi-Layer PCB Fabrication Capabilities

From Material Procurement to Finished Boards – The Complete Process

1. Material Procurement & Incoming Inspection
   We source all materials—laminates, prepreg, copper foil, and surface finish chemicals—from qualified suppliers. Every material shipment undergoes incoming inspection: material certification verification, dimensional checking, and quality documentation review. For low volume PCB assembly orders, we maintain the same rigorous material standards.

2. Inner Layer Processing
   Inner layer circuit patterns are produced through photo imaging and etching. Our advanced imaging equipment ensures accurate pattern transfer. AOI inspection verifies trace integrity and detects any defects before lamination.

3. Lamination
   Inner layers are laminated with prepreg and copper foil under controlled temperature and pressure. Layer alignment is verified through X-Ray inspection to ensure proper registration between layers.

4. Drilling
   Precision drilling creates vias and through-holes. Advanced drilling equipment with automated depth control ensures accurate hole positioning. Drill quality is verified through measurement and visual inspection.

5. Plating & Outer Layer Processing
   Through-hole plating ensures reliable electrical connections between layers. Outer layer circuits are produced through photo imaging and etching. Final trace integrity is verified through AOI inspection.

6. Surface Finishing
   We offer multiple surface finishes to meet your application requirements—ENIG, HASL, OSP, Immersion Silver, Immersion Tin, and Gold Plating. Each finish is applied and verified to specification.

7. Electrical Testing
   Every board undergoes 100% electrical testing—flying probe or fixture-based testing—to verify continuity and isolation. For low volume PCB assembly, flying probe testing provides cost-effective verification without fixture development.

8. Final Quality Inspection
   Comprehensive final inspection including AOI, dimensional measurement, visual inspection, and packaging verification.

Why Choose Studio for Multi-Layer PCB Fabrication?

• Up to 20-Layer Capability – Advanced fabrication equipment supports complex, high-density designs

• Rigorous Quality Control – Every layer is inspected; every board is tested—100% coverage

• Material Flexibility – FR4, High-TG, Halogen-Free, Rogers, and specialty materials

• Complete Turnkey Service – From component sourcing and PCB fabrication to assembly and shipping

• Low Volume Support – Competitive pricing for low volume PCB assembly and prototype orders

Studio delivers Multi-Layer PCB Fabrication—up to 20 layers with uncompromising quality control.