Magnetron Sputtering Deposition in Magnetic Recording Industry

Applications

Working Principle

Magnetron sputtering is to form an orthogonal EM field above the cathode target surface. After the secondary

electrons generated from sputtering are accelerated to be high energy electrons in the cathode fall region, they

do not directly fly to the anode but oscillate back and forth which is similar to cycloid under the action of orthogonal

EM field. High energy electrons constantly collide with gas molecules and transfer energy to the latter, ionizing them

into low energy electrons. These low energy electrons eventually drift along the magnetic line of force to the auxiliary

anode near the cathode and then are absorbed, avoiding the strong bombardment from high-energy electrons to polar

plate and eliminating the damages to the polar plate caused by the bombardment heating and electron irradiation in

secondary sputtering, which reflects the “low temperature” characteristic of the polar plate in magnetron sputtering.

The complex motions of electrons increase the ionization rate and realize high-speed sputtering due to the existence

of magnetic field.

Features

Coating Sample

Process Steps

→ Place the substrate for coating into the vacuum chamber;
→ Vacuumize the vacuum chamber at high and low temperature, and rotate the substrate synchronously;
→ Start coating: the substrate is contacted with precursor in sequence and without simultaneous reaction;
→ Purge it with high-purity nitrogen gas after each reaction;
→ Stop rotating the substrate after the film thickness is up to standard and the operation of purging and cooling is

completed, then take out the substrate after the vacuum breaking conditions are met.

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