Precision Grinding And Polishing Machine HAP-100U
I, Features
1. This product is used for precision grinding and polishing with high removal accuracy;
2. The sample is vacuum adsorbed, and the sample plate can be used for grinding and polishing 4-inch (HAP-200U: 6-inch) wafers;
3. The sample tilt angle can be adjusted;
4. The sample is gravity-pressurized, and the loading force is continuously adjustable;
5. The sample swings left and right to achieve semi-automatic grinding and polishing;
6. The swing speed of the swing arm is even and adjustable;
7. The swing range of the swing arm is adjustable from 0 to 15 degrees;
8. Adopt independent 1KW high -power motor with large torque. No matter the speed is fast or slow, the torque is large and constant.
9. The grinding and polishing disc has a wide range of speeds, from 5 rpm to 100 rpm ;
10. Full touch screen interface, easy to set grinding and polishing parameters;
11. All grinding and polishing parameters such as rotation speed, grinding and polishing time, rotation direction, etc. are automatically saved and easily called up;
12. Connect and control the droppers of four stations with different abrasives;
II. Technical Parameters
namesay | regulation grid |
model | HAP-100U | HAP-200U |
Number of grinding and polishing heads | 1 | 2 |
Sample diameter | 3 (option: 4 inch), can be used for grinding and polishing 3 (option: 4 inch) wafers | 5 (option: 6 inch), can be used for grinding and polishing 5 (option: 6 inch) wafers |
Polishing resolution | 1 micron |
Sample tilt angle | 0-10 degrees adjustable |
Sample loading force | Continuously adjustable from 0-4 kg |
Sample swing speed | Adjustable |
Swing range of arm | 0-15 degrees adjustable |
Grinding and polishing disc diameter ( mm) | φ300 | φ400 |
Grinding and polishing disc motor power | 1Kw |
Speed (r/min) | 5 -1 00 |
Rotation direction | Counterclockwise/clockwise optional, automatic switching between forward and reverse |
Four-speed manual (r/min) | V1=5, V2=15, V3=25, V4=50 (user-customizable speed) |
Automatic grinding and polishing parameters | 64 types ( parameters include: speed, time and grinding disc rotation direction ) |
Grinding and polishing parameters | Users can set and call |
Number of dripper units | Unit 4 |
Dripping speed | 1-100 ml/min |
power supply | Voltage: AC220V, Frequency: 50HZ |
Overall dimensions ( mm ) | 760 x 4 30 x 3 60 (length*width*height) |
weight | 30 kg |
Serial number | Part name | quantity | Part name | quantity |
1 | HAP- 100U Precision Grinding and Polishing Compound | 1 unit | Vacuum Pump | 1 unit |
2 | Precision grinding jig | 1 set | Dropper (option) | 1 unit |
3 | Gas washing bottle (including connecting pipe) | 1 set | Adhesive flocked polishing cloth 300mm | 10 pcs |
4 | Adhesive sandpaper 300mm 180# | 10 pcs | Adhesive canvas polishing cloth 300mm | 10 pcs |
5 | Adhesive sandpaper 300mm 320# | 10 pcs | Diamond suspension polishing liquid 1, 3,6 micron, 200 ml | 1 bottle each |
6 | Sandpaper with adhesive backing 300mm 600# | 10 pcs | Anti-stick disc 300mm | 1 |
7 | Sandpaper with adhesive backing 300mm 1000# | 10 pcs | Magnetic plate 300mm | 1 |
8 | Adhesive sandpaper 300mm 2000# | 10 pcs | | |
9 | Anti-stick disc pry bar (used for placing and prying the anti-stick disc) | 1 | | |
| Technical documents: 1 copy each of product instruction manual, product certificate and warranty card |
