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Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT
Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT
Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT
Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT
Specifications
Overall Dimensions (WxDxH) :
1100 x 1100 x 2100 mm
Detector Frame Rate :
18 fps
Software - CNC Inspection :
Single-point and matrix programming with graphical results
Power Supply :
380 VAC / 50 Hz
Tube Voltage :
90 / 130 / 150 kV (optional)
Payment Terms :
T/T, L/C
Max Inspection Area :
330 x 330 mm
Place of Origin :
Zhejiang, China
Certification :
ISO 9001, CE
System Magnification :
> 500X
System Type :
Industrial CT / Micro-Focus X Ray Inspection System
Supply Ability :
100 Sets per Month
Delivery Time :
20-30 working days
Packing Dimensions (WxDxH) :
1300 x 1300 x 2300 mm
Weight :
Approx. 1500 kg
Tube Current :
0.1 - 500 uA
Detector Pixel Matrix :
1172 x 1260
Brand Name :
HUIWEI
Minimum Focal Spot Size :
<= 10 um
Max Tilt Angle :
Rotating swing arm up to +/-60 degrees
Applications :
PCB/PCBA, SMT, BGA/CSP/Flip chip/QFN, electronic components, lithium battery, encapsulation, R&D labs
Software - Image Stitching :
Stitching for large PCB/PCBA samples
Warranty :
12 Months
MOQ :
1 Set
Packaging Details :
Standard export plywood case with shockproof protection
Model :
HS-ST-90/130/150
Software - Auto Void Analysis :
Automatic void/bubble measurement for BGA, QFN with report export
Price :
Negotiable
Max Output Power :
8 / 60 / 65 W
Model Number :
HS-ST-90/130/150
Detector Pixel Size :
49.5 um
Software - Navigation :
Quick positioning on the physical image
Software - Measurement Tools :
Distance, angle, diameter, polygon geometry measurement
Detector Type :
CMOS
Max Object Size :
Phi460 x 560 mm
Description

Product Introduction

The HS-ST-90/130/150 Industrial CT / Micro-Focus X-Ray Inspection System is a cost-effective, professional-grade non-destructive testing solution designed for precision electronics manufacturing and R&D. Equipped with a high-resolution imaging chain (CMOS detector, ≤10um micro-focus X-ray source and >500X system magnification), it clearly captures tiny defects in BGA, CSP, Flip chip, QFN packages and PCB boards, as well as components such as ICs, capacitors and resistors. Multi-angle observation and automatic void (porosity) analysis make it an all-in-one solution for high-precision, high-efficiency and high-safety inspection.

Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT

Core Selling Points

  • Micro-focus source: minimum focal spot ≤10um for sharp, high-resolution images
  • Multi-energy options: 90 / 130 / 150 kV selectable to suit different sample densities
  • Powerful magnification: system magnification >500X for micro-defect detection
  • High-speed CMOS detector: 1172 × 1260 matrix, 49.5um pixel, 18 fps imaging
  • Multi-angle observation: rotating swing arm with up to ±60° tilt
  • Automatic void analysis: auto bubble/porosity measurement for BGA, QFN with report export
  • Image stitching: stitch large PCB / PCBA samples into one full-field image
  • CNC automatic inspection: single-point & matrix programming with graphical results
  • Cost-effective turnkey CT: an economical complete system for end users and R&D labs

Technical Parameters

Whole Machine

Dimensions (W × D × H)1100 × 1100 × 2100 mm
Packing Dimensions (W × D × H)1300 × 1300 × 2300 mm
WeightApprox. 1500 kg
Power Supply380 VAC / 50 Hz

X-Ray Source

Tube Voltage90 / 130 / 150 kV (optional)
Max Output Power8 / 60 / 65 W
Tube Current0.1 – 500 uA
Minimum Focal Spot Size≤ 10 um

Detector

Detector TypeCMOS
Pixel Size49.5 um
Pixel Matrix1172 × 1260
Frame Rate18 fps
Max Tilt AngleRotating swing arm up to ±60°
System Magnification> 500X

Software System

NavigationQuick positioning on the physical image
Auto AnalysisAutomatic void/bubble measurement for BGA, QFN and other packages, with report export
Measurement ToolsDistance, angle, diameter, polygon and other geometry measurements
Image StitchingStitching for large samples such as PCB / PCBA, with save support
CNC InspectionSingle-point and matrix programming to quickly generate routines with graphical results

Motion Control System

Max Object SizeΦ460 × 560 mm
Max Inspection Area330 × 330 mm

Applications

Ideal for end users performing precision electronics and NDT inspection:

  • PCB / PCBA and SMT assembly inspection
  • BGA, CSP, Flip chip and QFN package void analysis
  • Electronic components, IC, capacitor and resistor inspection
  • Lithium battery inspection
  • Encapsulation testing and quality control
  • R&D and test laboratories

Company Profile

Hangzhou Huiwei NDT Equipment Co., Ltd. is a national high-tech enterprise specializing in the R&D and manufacture of industrial X-ray and CT inspection equipment. With decades of experience in portable DR, CT and flaw detection products, we provide reliable imaging solutions to manufacturers, inspection companies and research institutions worldwide, and welcome end-user and OEM/ODM cooperation.

Shipping Information

  • Packaging: Standard export plywood case with shockproof protection, suitable for sea and air freight.
  • Delivery Time: 20–30 working days after order confirmation.
  • Shipping Terms: EXW / FOB / CIF available; sea freight recommended for this system.
  • Port: Shanghai / Ningbo, China.

After-Sales Service

  • 12-month warranty on the X-ray source and detector.
  • On-site installation, commissioning and operator training available.
  • Lifetime technical support and software update guidance.
  • English operation manual and remote technical support.

Contact Us

For end users, R&D laboratories and system integrators, please send your inquiry now. Our team will reply within 24 hours with detailed quotation, configuration options and technical documents.

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Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT

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Product Detail
Overall Dimensions (WxDxH) :
1100 x 1100 x 2100 mm
Detector Frame Rate :
18 fps
Software - CNC Inspection :
Single-point and matrix programming with graphical results
Power Supply :
380 VAC / 50 Hz
Tube Voltage :
90 / 130 / 150 kV (optional)
Payment Terms :
T/T, L/C
Contact Supplier
Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT
Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT

Hangzhou Huiwei Nondestructive Equipment Co.,Ltd,

Verified Supplier
2 Years
zhejiang, hangzhou
Since 1993
Business Type :
Manufacturer, Distributor/Wholesaler
Main Products :
NDT X Ray Equipment, NDT Inspection Equipment, NDT Radiography Equipment
Total Annual :
10000000-50000000
Employee Number :
50~500
Certification Level :
Verified Supplier
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