1.6-layer HDI thick copper board PCB

HDI PCB, short for High-Density Interconnect Printed Circuit Board, is a high-precision circuit board that adopts microvias (blind vias, buried vias, stacked vias, etc.), fine conductors (usually line width/space ≤ 4mil/4mil) and advanced lamination technology. Its core feature is to achieve higher circuit density and component integration within a limited board space, which can meet the development needs of electronic devices for "miniaturization, lightweight, and high performance". It is widely used in fields such as 5G communications, medical imaging, smart wearables, automotive electronics, and aerospace. Compared with traditional PCBs, HDI PCBs can significantly reduce the board size (usually by 25%-40%) by reducing the diameter of vias and optimizing the interlayer connection method, while improving signal transmission speed and stability, and reducing electromagnetic interference.

2.Product Features:

• High-density interconnection
• Micro via
• Blind and buried hole design
• Multi-level design
• Fine lines and fine pitch
• Excellent electrical performance
• Highly integrated

3.Industry-Specific Applications (Help Buyers "See Their Use Case")

• 5G & Telecommunications: 5G small cells, base station transceivers, and optical modules—handles high-frequency signals (sub-6GHz/mmWave) without interference.
• Medical Equipment: MRI scanners, portable ECG monitors, and dental imaging devices—medical-grade materials ensure biocompatibility and compliance with ISO 13485.
• Automotive Electronics: ADAS (Advanced Driver Assistance Systems), in-vehicle infotainment, and EV battery management—resists vibration (10-2000Hz) and humidity (85℃/85%RH, 1000h).
• Aerospace & Defense: UAV (drone) flight controllers, satellite communication modules—meets MIL-STD-202G for shock, temperature, and altitude resistance.

4. Material & Reliability (Meet Global Industry Standards)