FR4 4-layer PCB
Advantages of Multilayer PCB:
- Increase circuit board density
- Reduce size
- Better signal integrity
- Adapt to high-frequency applications
- better thermal management
- Higher reliability
product Features:
- Multi-layer design
- Inner layer and outer layer
- through hole
- Copper layer
- Dielectric layer (dielectric material)
Manufacturing process:
- Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
- Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
- Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
- Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).