Vacuum brazed liquid cold plate is a high-performance liquid cooling component manufactured via vacuum brazing technology, mainly used for high-efficiency heat dissipation in high-power-density equipment. By circulating coolant through sealed internal channels to directly remove heat from heat sources, it has become a mainstream solution in high-end thermal management thanks to its core advantages: oxidation-free, high tightness, low deformation, and excellent corrosion resistance.

Vacuum brazing is a welding process performed in a vacuum environment (10⁻³~10⁻⁵ mbar):

1. Assembly: Precisely stack the base plate with machined flow channels, brazing foil (Al‑Si, Cu‑P, etc.), and cover plate.
2. Vacuum Heating: Place the assembly into a vacuum furnace, evacuate the air, then heat to the melting point of brazing filler metal (approx. 577℃-600℃), which is lower than the melting point of the base metal (aluminum/copper).
3. Capillary Filling: The molten brazing filler fills all gaps between the base plate, cover plate, and internal fins via capillary action.
4. Metallurgical Bonding: Atomic diffusion occurs between liquid brazing filler and base metal; upon cooling, it forms high-strength, high-thermal-conductivity, fully sealed integrated joints.
5. Cooling & Forming: Slow cooling under vacuum minimizes thermal stress and ensures zero workpiece deformation.

• Aluminum Alloy (6061/6063): Most widely used — high thermal conductivity, lightweight, low cost, and easy to machine.
• Copper (C1100/T2): Best thermal performance, ideal for ultra-high heat flux applications such as AI chips and IGBTs.
• Stainless Steel / Titanium Alloy: Used for special harsh environments requiring high corrosion and temperature resistance (aerospace, chemical industry).

• Ultra-Clean & Oxidation-Free: Vacuum environment eliminates oxidation, flux residue, porosity, and corrosion risks.
• Strong Sealing & Pressure Resistance: Monolithic structure with zero leakage; typical pressure rating 1-10 MPa.
• Extremely Low Thermal Resistance & High Efficiency: Near‑zero welding thermal resistance; combined with microchannels/fins, thermal resistance can reach as low as 0.02℃*cm²/W.
• Precise Structure & Minimal Deformation: Uniform overall heating ensures high flatness, suitable for precision electronic components.
• High Design Flexibility: Supports complex channels, multi-path layouts, microchannels (0.5 mm), embedded fins, etc.
• Long Service Life & High Reliability: Corrosion‑free and loosening‑free; industrial service life exceeds 10 years.

• Single-Layer Grooved Channel: Base plate with machined grooves + cover plate; simple structure for low‑to‑medium power.
• Offset / Louvered Folded Fins: Embedded corrugated or serrated fins greatly increase heat exchange area and fluid turbulence; preferred for AI and high-performance computing.
• Skived Fin: Fins integrally cut from the base plate, eliminating contact thermal resistance for extremely high thermal conductivity.
• Microchannel Structure: 50-150 μm scale channels, heat flux > 350 W/cm², ideal for SiC/GaN power modules.

• AI & Data Centers: Liquid cooling plates for GPUs (NVIDIA H100/H200, A100, etc.) and server cold plates.
• New Energy Vehicles: Power battery pack cold plates, motor control units (MCU), OBC, and IGBT cooling.
• Energy Storage & Power Electronics: PCS, SVG, photovoltaic inverters, high-voltage inverters.
• Aerospace & Defense: High-reliability cooling for radar, laser equipment, and satellite payloads.
• Medical & Lasers: Precision temperature control for CT, MRI, and high-power lasers.

Vacuum brazed liquid cold plate represents the gold standard for high-performance thermal management, perfectly balancing thermal conductivity, structural strength, sealing reliability, and design flexibility.