The Liquid Cold Plate serves as the core heat exchange component of liquid cooling systems. Through its metal substrate and internal sealed flow channels, it efficiently transfers heat from heating devices to circulating cooling liquid, which is then dissipated externally via heat exchangers. This system offers significantly higher heat dissipation efficiency compared to traditional air cooling and is widely used in high power density applications.

Core components include:

• Bottom plate (aluminum/copper, directly attached to heat source)
• Internal flow channel (serpentine/parallel/microchannel configurations)
• Cover plate (seals flow channel)
• Liquid inlet and outlet joints

Common cooling liquids include deionized water and water-glycol mixtures.

Heat source → metal bottom plate heat conduction → flow channel wall → flowing coolant absorbs heat → coolant flows to CDU/radiator for heat dissipation → cooled liquid returns to cold plate, forming a closed-loop system.

• Low thermal resistance (0.02 - 0.05°C/W)
• High heat dissipation power
• Excellent temperature uniformity
• Low noise operation

Ideal for applications including data centers with stand-alone cabinet power of 50kW+, AI chips, and new energy vehicle battery packs.

Microchannels (<1mm) enhance heat transfer coefficient but increase pressure drop. Serpentine flow channels provide excellent temperature uniformity. Flow velocity and flow resistance must be carefully balanced for optimal performance.

100% leak testing (helium test) is mandatory, with extremely low static leakage rates. Burst pressure typically exceeds three times the rated operating pressure for maximum reliability.

Aluminum offers high cost performance and lightweight properties for general applications. Copper provides superior thermal conductivity for ultra-high heat flux density scenarios.