This newly upgraded copper water-cooling cold plate is integrally manufactured via precision Friction Stir Welding (FSW). Specially designed for high-end heat dissipation scenarios such as medical equipment and precision instruments, it features efficient heat conduction, stable temperature equalization and long-term operational reliability, meeting the cooling requirements of various rack-mounted devices.

Adopting solid-state friction stir welding technology, it produces no molten pool, no filler material and no cold solder joints. The internal channels deliver outstanding sealing performance, effectively avoiding leakage, gaps and high thermal resistance commonly found in traditional welding processes.

The main body is processed from high-thermal-conductivity copper with precisely milled fluid channels. High overall strength and structural stability after welding make it suitable for harsh operating environments.

• Ultra-high heat transfer efficiency: The copper base offers excellent thermal conductivity. Combined with seamless FSW welding, it provides smooth heat transfer paths to rapidly dissipate heat generated during device operation with accurate and stable temperature control.
• Safe, durable and low-loss: Integral forming eliminates assembly gaps for reliable sealing. Vibration-resistant and corrosion-resistant, it resists leakage and aging during long-term operation, satisfying continuous stable operation requirements of precision equipment.
• Medical-grade clean craftsmanship: Full-process precision machining and cleaning treatment result in smooth, burr-free surfaces, ideal for scenarios with strict cleanliness and stability standards such as medical instruments and precision industrial control systems.
• Rack-mount compatible structure: Regular shape and standardized mounting holes enable direct assembly with rack-mounted devices, compatible with various modular cooling systems.

Medical imaging equipment, precision testing instruments, rack-mounted industrial control devices, laboratory precision power supplies, high-end energy storage control modules, high-power precision electronic devices, etc.

Surface treatments including passivation and precision cleaning are available. Fluid channel layout, inlet/outlet specifications and mounting dimensions can be customized on demand to match heat dissipation solutions for different devices.