Traditional Liquid Cooling Plate: Coolant flows in parallel within enclosed channels for heat exchange, featuring thick thermal boundary layers, high thermal resistance, and susceptibility to hot spots at distant positions.

High-Frequency Jet Impingement Type:

• Coolant passes through a dense array of micro-nozzles (diameter 0.1-1 mm)
• Impinges vertically at high speed onto the inner wall of the cold plate (heating surface)
• Instantly breaks the thermal boundary layer, increasing local heat transfer coefficient by 5-10 times
• Fluid diffuses rapidly and drains laterally, achieving extremely uniform temperature across the entire area (temperature difference < ±1℃)

• Upper Chamber (Distribution Chamber): Stabilizes pressure and distributes coolant evenly to nozzles
• Nozzle Plate: Core component with hundreds to thousands of precision micro-holes (high-frequency jet array)
• Impingement Chamber (Heat Exchange Zone): Jet impingement and intensive convective heat transfer
• Liquid Collection Chamber / Drainage Channel: Quickly discharges the heat-absorbed coolant

• Extremely High Heat Dissipation Capacity: Heat flux density: 200-1000 W/cm² (ordinary brazed plate approx. 50 W/cm²); Thermal resistance as low as 0.01-0.03 ℃/W
• Excellent Temperature Uniformity: Full-surface temperature difference: ±0.5-±1℃; Completely eliminates local hotspots
• Fast Response Speed: Low thermal inertia, precise temperature control, suitable for transient high-power and pulse heating scenarios
• Relatively High Pressure Drop: Requires matching high-pressure pump / high-flow cooling system
• High Manufacturing Precision Requirements: Nozzle hole diameter, depth, and position tolerance: ±0.02-±0.05 mm

• Precision Drilling + Vacuum Brazing: Suitable for circular hole arrays with stable mass production; Common materials: aluminum alloy / copper alloy, brazed sealing
• Photolithography / Etching + Diffusion Bonding: Suitable for special-shaped nozzles and micro-scale slot jets; Finer flow channels and lower thermal resistance (for AI/GPU/laser applications)
• 3D Printing (SLM): Integrated forming with complex topological channels + nozzles; Lightweight design, suitable for customized aerospace components

• AI / Supercomputing Chips: H100/H200, GPU clusters, TPUs (>500W chips)
• SiC / GaN Power Modules: 800V electric drives, ultra-fast charging stations
• High-Power Lasers: fiber / semiconductor / UV lasers (heat flux > 300W/cm²)
• Radar / Phased Array: T/R components, 5G/6G base stations
• Medical Imaging: MRI gradient amplifiers, CT detectors (temperature control accuracy ±0.5℃)
• Aerospace: satellite payloads, missile guidance (vibration-resistant, lightweight, high heat flux)