PCY-D-III Ultra-low Temperature Thermal Expansion Coefficient Tester Meter Testing Machine
Product Introduction
This instrument tests the low-temperature linear expansion coefficient according to the standard "GJB1875-94 Test Method for Thermophysical Properties of Rigid Foam Plastics". It measures the ultra-low temperature average linear expansion coefficient of various solid materials using the ejector method with imported high-precision micro-sensors to detect sample deformation values at different temperatures. Computer technology automatically completes detection, control, calculation, printing, and storage functions.
Product Parameters
- Temperature range: -196ºC (liquid nitrogen immersion temperature) ~ 300ºC
- Sample size: less than 20×20×50mm (3 samples can be tested simultaneously)
- High-precision micrometer sensor (imported) with range >15mm, resolution 0.1µm, accuracy 0.2µm
- Average linear expansion coefficient test range: 0.001~300.000×10-6/ºC
- Test accuracy: 0.2%
- Air circulation method: Centrifugal fan forced circulation
- Temperature control: ±1ºC of set value
- Heating time: 0 to +300ºC within 60 minutes
- Cooling time: 0 to -190ºC within 40 minutes
- Computer-controlled simultaneous testing of three samples with customizable channels
- Power supply: 220V, 4KW
| Temperature gradient |
1ºC |
| Temperature fluctuation |
≤±1ºC |
| Temperature deviation |
≤±1ºC |
| Temperature control meter display accuracy |
≤0.1ºC |
| Refrigeration method |
Liquid nitrogen |
| Heating method |
Heating tube heating |
| Studio size |
300×350×500mm |
Instrument Composition
The system consists of five main components:
- High-precision micro-sensor and data processing system
- High-precision high/low temperature test chamber
- Electric lifting mechanism
- Liquid nitrogen tank
- Computer temperature control system
Additional features include hollow electric tempered glass in the test chamber door for easy sample access, and imported intelligent temperature control with multiple protection functions (over-temperature, over-pressure, overload, fan overheating, PID over-temperature).