The Apex612W uncooled thermal imaging detector represents our advanced Wafer Level Packaging (WLP) detector series, delivering exceptional thermal imaging performance for demanding applications.
Wafer Level Packaging (WLP) technology enables high vacuum packaging directly on the entire MEMS wafer, followed by scribing and cutting to produce individual infrared detectors. This cost-effective approach achieves fully optimized SWaP-C (Size, Weight, Power, and Cost) parameters while supporting mass production capabilities.
With high resolution 640x512 array and reduced 12μm pixel size, the Apex612W FPA infrared detector provides superior thermal imaging quality with 327,680 pixels. The larger array delivers more detailed images to meet requirements for higher resolution and wider field of view applications.
| Model | Apex612W |
|---|---|
| Sensitive Material | VOx |
| Package | Wafer-Level |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Response | 8μm~14μm |
| NETD | ﹤40mK |
| Output Signal | Built-in 14 bits ADC |
| Thermal Response Time | ﹤12ms |
| Max. Frame Rate | 50Hz |
| Power Consumption | ﹤150mW |
| Size(mm) | 17.3×17.3 |
| Weight(g) | <2.5g |
| Operating Temperature | -40℃ ~ +85℃ |
Our Vision: To push the boundaries of sensing and transform the way people connect with the world around them.
Our Mission: To harness the power of infrared sensing technology to transform industries worldwide, enabling smarter decisions, safer environments, and a more connected future.
Our Value: To create advanced infrared technology that makes the world a better place.