COIN417G3 uncooled infrared module integrates 384x288 / 17μm wafer level package (WLP) infrared imaging detector that adopts the market preferred VOx material. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.

The COIN417G3 infrared module features sharp and crisp thermal image presentation, compact size and low cost.

We are a supplier of cooled and uncooled infrared detectors and infrared thermal imaging modules. These infrared FPA detectors and thermal camera cores are partial components of infrared thermal cameras, which are specially used for the secondary development requirements of the integrators.

• Comprehensive Functionality, Cost-Effective Design
  • Developed using a high cost-performance wafer-level packaging detector
  • Integrated with advanced image processing algorithms to enhance image quality
• Outstanding Performance, Superior Imaging
  • High sensitivity with a typical NETD≤30mK
  • Next-generation image algorithms deliver clearer, sharper thermal images
• Flexible Extension, Rapid Integration
  • Multiple optical lens options available to suit diverse application scenarios
  • Supports USB2.0/DVP/LVDS/BT.656 image output interfaces
  • Outputs RAW/YUV image data with serial port control

• Complete Documentation: Product manuals, setup guides, and selection references. Get started without guesswork.
• Development & Testing Assistance: Sample Integrated Testing, performance evaluation, and parameter verification made easy.
• Advanced Developer Toolkit: SDKs, APIs, algorithms, and debugging tools for deep integration.
• Remote Technical Support: 24/7 support--quick response and timely resolution for critical issues.
• Warranty: Original parts and strict process adherence to restore optimal performance.

In nature, all objects whose temperature is higher than absolute zero (-273℃) can radiate infrared rays. By using the infrared camera detector to measure the infrared radiation temperature difference between the target itself and the background, you can get different infrared images, which are also called thermal images.

Infrared radiation that emitted by target enters the sensing range of the thermal detector, then the infrared detector converts the radiation signal of different intensity into the corresponding electrical signal, and then through amplification and video processing, forms the infrared image that can be observed by the naked eyes.

Uncooled infrared focal plane detector does not need an Integrated Dewar Cooler Assembly (IDCA) device and can work at room temperature. It has the advantages of fast start, low power consumption, small size, light weight, long life, low cost and so on. Although the sensitivity of uncooled infrared focal plane detector is not as good as that of cooled infrared detectors, after years of development, its cost performance has been obviously better than the cooled detector, which has a broader application prospect.