The COIN1212 infrared camera core adopts a high-performance 1280×1024 12μm megapixel wafer-level infrared detector, paired with premium signal processing circuits and professional imaging algorithms. Supporting mainstream serial protocols, multiple video output interfaces and diverse optical lens configurations, it delivers fast hotspot detection and ultra-clear thermal imaging. Optimized for simplified secondary development, this all-in-one thermal imaging core is ideal for high-end scenarios including key infrastructure monitoring, advanced manufacturing, intelligent transportation and professional scientific research.

• 1280×1024/12μm megapixel resolution enables wide field-of-view and long-range HD imaging
• Captures fine target details clearly during close-range observation

• Built with an industry-leading large-format wafer-level infrared detector
• Integrated with advanced image processing algorithms to enhance image clarity and visual quality

• Supports multiple image output interfaces including DVP and BT.1120
• Outputs RAW/YUV image data with serial port control

The COIN1212 thermal imaging module is applied in the field of Key Infrastructure Monitoring, High-end Manufacturing, Industrial Inspection, Scientific Research etc.

In infrared thermal imaging technology, long-wave thermal detectors has strong penetration through dusty atmospheres, are not disturbed by sun glint effects and light reflections. Outstanding image quality can be obtained in various complex environments, such as vehicle drives in the dusty atmosphere, ship sails on the water with reflective light and aircraft is flying through the cloud.

The dual-color cooled infrared detector combines the advantages of mid-wave and long-wave detection into one cooled infrared detector assembly, which can simultaneously perform high-performance imaging in the duel wavebands, greatly reducing the false alarm rate. It can be used for the detection of complex backgrounds and the monitoring of high-speed moving targets.