High purity AlN powder for electronic materials is the best material choice for sintering AIN substrate. The sintered AIN substrate has ultra-high thermal conductivity, high electrical insulation and thermal
expansion properties similar to those of semiconductor materials such as silicon wafer. It is widely used in the electronic packaging industry. We uses the carbonthermal reductionmethod to produce high purity
electronic level aluminum nitridepowder. In thismethod-you could obtain stable process control and very wide raw material supply.
Advantage:
1. High purity.
2. Narrow particle size distribution.
3. It can be used in a wide range of applications,such as casting for
substrate, granulation powder and filler powder.
4. The particle size can be customized according to the needs of different
scenarios to meet the customization needs.
Parameter
| Item | H-2 | M-3 |
| Specific surface area | ≥2.0 | ≥2.0 |
| Mean particle size | ≤2.0 | ≤2.0 |
| 0(wt%) | ≤0.95 | ≤0.95 | |
| C(ppm) | ≤0.045 | ≤0.050 | |
| Impurity | Ca(ppm) | ≤200 | ≤200 |
| Si(ppm) | ≤50 | ≤70 | |
| Fe(ppm) | ≤30 | ≤50 |
H-2

H-3
