Tantalum Chip Capacitors

Product Overview

These are solid tantalum chip capacitors specifically designed and manufactured for surface mount technology. They offer a lower equivalent series resistance (ESR) compared to CA42 resin-encapsulated products and are suitable for automatic surface mounting. Widely used in sophisticated , computer, and mobile phone applications, these capacitors adhere to EIA535BAAC and QC300801, Q/YHC.45-01 technical standards.

Product Attributes

• Type: Multilayer Ceramic Capacitor / Tantalum Capacitor
• Form Factor: Chip
• Mounting Type: Surface Mount
• Standards: EIA535BAAC, QC300801, Q/YHC.45-01

Technical Specifications

Case Codes and Dimensions

Capacitance and Voltage Combinations (Example Data)

Notes on Measurement Conditions

• Capacitance and Dissipation Factor: Measurement voltage: U- = 2.2V 1.0V or U- = 1.0V 0.5V (RMS); Test frequency: 120Hz.
• DC Leakage Current: Measured at rated voltage, with a charging time not exceeding 5 minutes. For 125 leakage current, category voltage is applied.
• Equivalent Series Resistance (ESR): Measurement frequency (120 5) KHz; U- = 2.2V 1.0V or U- = 1.0V 0.5V (RMS).

Important Usage Considerations

• Operating Voltage: To ensure reliability, reduce applied voltage in practical circuits, especially in low impedance circuits (recommend 1/3 rated voltage) and other circuits (recommend 2/3 rated voltage).
• Reverse Voltage: Tantalum capacitors are polarized. Do not apply reverse voltage or use in AC-only circuits. Limited reverse voltage is permissible for short durations (10% U
  R or 1V at 25; 5% U
  R or 0.5V at 85).
• Ripple Voltage: Operate within specified ripple voltage limits. The sum of DC bias and AC peak voltage must not exceed the rated voltage. The sum of AC negative peak and DC bias must not exceed the allowable reverse voltage.
• Ambient Temperature: Use within the specified operating temperature range. Voltage derating is required above +85.
• Frequency Dependence: Electrical characteristics change significantly around 10KHz. Confirm circuit characteristics when used in high-frequency circuits.
• Reliability: Failure rate varies with usage conditions (temperature, voltage, circuit resistance, etc.). Select products after thorough evaluation of operating conditions.
• Mounting Precautions: Avoid excessive mechanical or thermal shock during mounting. Do not reuse dropped or previously mounted capacitors. Do not process or bend terminals after installation. Avoid direct contact with leads to prevent contamination.
• Circuit Board Cleaning: Remove flux and residual acids/alkalis quickly. Cleaning temperature should be below 50. Total immersion time (ultrasonic, steam) should be within 5 minutes.
• Soldering (Soldering Iron): Tip temperature below 350, duration within 4 seconds. Avoid touching the capacitor body.
• Soldering (Chip Type): Avoid highly active or acidic fluxes. Consider component packaging and board variations for temperature. Use jet or reflection methods under specified conditions. For wave soldering, preheat below 160 for <2 minutes, and cool slowly. For other methods, consult manufacturer.
• Reflow Soldering: Use under specified conditions.
• Usage Environment: Do not use in environments with direct contact with water, brine, oil, direct sunlight, high temperature/humidity causing condensation, reactive gases, acids/alkalis, high-frequency waves, or excessive vibration/shock.