| Solderability | Lead-free solder bath at 2455C for 30.3s. | 4.17 | Wettable area 95% |
| Resistance to Soldering Heat | Lead-free solder bath at 2705C for 101s. | 4.18 | R (1.0%R+0.5m), No mechanical damage |
| Substrate Bending Test | Bending distance: 4mm, Duration: 5s. (for 1206, 1210, 2010, 2512) | 4.33 | R (1.0%R+0.5m), No mechanical damage |
| Max. Overload Current | (A) | 4.56 | 0402: 1.83, 0603: 3.16, 0805: 4.56, 1206: 7.91, 1210: 12.5, 2010: 17.68, 2512: 25, 2512-2W: 35.36 |
| Temperature Rapid Change | -55C (30min) ~ 155C (30min), 300 cycles. | 4.19 | R (2.0%R+0.5m) |
| Short Time Overload | 2.5 times rated current or max. overload current (whichever is lower) for 5s. | 4.13 | R (1.0%R+0.5m), No mechanical damage |
| Damp Heat Steady State | 70C2C, 93%RH3%RH, 1000h. | 4.24 | R (3.0%R+0.5m), No mechanical damage |
| Endurance at 70C | 70C2C, 1000h rated current or limiting element current (whichever is lower) for 1.5h ON/0.5h OFF. | 4.25.1 | R (2.0%R+0.5m), No mechanical damage |
| Endurance at Upper Category Temp. | 155C2C, 1000h. | 4.25.3 | R (5.0%R+0.5m), No mechanical damage |
| Operation at Low Temperature | -55C5C, 1h without load, rated current or limiting element current (whichever is lower) for 45min, 15min without load. | 4.36 | R (1.0%R+0.5m), No mechanical damage |
| Insulation Resistance | Apply DC 100V between substrate and terminations for 1min. | 4.6 | 1000M |
| Voltage Proof | Apply max. overload voltage of AC RMS at a rate of approx. 100V/s between substrate and terminations for 60s 5s. | 4.7 | No breakdown or flashover |
| Component Solvent Resistance | Isopropyl alcohol (IPA) for 10h. | 4.29 | No mechanical damage |
| Shear Test | Applying force: 0603: 5N, 0805: 9N, 1206: 12N, 1210: 25N, 2010: 45N, 2512: 45N. Duration: 10s 1s. | 4.32 | No mechanical damage |