| Environmental Parameters | - Thermal Cycle: 0.50, 5 cycles -65C to +125C
- Short Time Overload: 0.50, 2 times rated working voltage for 5 seconds (100V maximum)
- Moisture Resistance: 0.50, 106, 240 hours, 0.1 rated load, -10C to +65C, 90% RH
- Load Humidity: 1.00, 1,000 hours, 0.1 rated load, +70C, 85% - 92% RH
- High Temperature Exposure: 1.00, 240 hours @ +125C, no load
- Load Life: 1.00, 108, Condition F, 2,000 hours @ +70C, rated load
- Resistance to Solder Heat: 0.25, 30 seconds @ +218C, dwell
- Mechanical Shock: 0.25, 213 Condition I, 100g, 1m second, 3 shocks each plane
- Vibration: 0.25, 204 Condition D, 20g, 10Hz - 2,000Hz, 4 hours per plane
- Leaching Test: No leach > 50% EIA/IS-703-4.13.B, Immerse in +245C 5C SAC305 solder pot for 30 sec.
- Shear Test: NA, 2,000PSI
- Low Temperature Storage: 0.25, 24 hours @ -65C, no load
- Low Temperature Operation: 0.25, 45 minutes @ -65C, full load
- Flammability: N/A, 94V-0
- Non-Fungus: Pass
- Resistance to Solvents: Pass, Isopropyl alcohol, Freon TMC
- Solderability: Pass, RMA Flux, +230C, 5 seconds dip, 95% coverage
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