Feature 1 | Flexible IC Feeding & Discharging Form
Supports dual incoming packaging of tape & reel / tray packaged ICs.
Available with four flexible production working modes: Tape-in Tape-out / Tape-in Tray-out / Tray-in Tray-out / Tray-in Tape-out, freely switch feeding & unloading method to match diversified downstream packaging requirements of PCB, SMT and finished electronic assembly.

Feature 2 | High-efficiency 12 Programming Positions + Dual CCD Visual Positioning + Optional Marking Dotting
Equipped with 12 independent programming stations to boost hourly UPH for mass chip burning.
Adopts upper & lower dual CCD vision alignment system to ensure high-precision component positioning, effectively avoid offset & pick failure during programming.
Customizable dot marking function is optional for IC batch traceability, convenient for defective product screening and production trace management.

Feature 3 | Quick-change Drop-in Programming Socket Design & Wide Compatibility
Adopts plug-and-play drop-in programming sockets for straightforward installation and operation.
Multiple different specification sockets can be pre-installed in advance according to various IC models, drastically shorten model changeover downtime on production line.
Great equipment versatility to cover wide range of MCU, Flash, EEPROM, SOP/QFN packaged chips, reduces extra equipment procurement cost for multi-model production.

Feature 4 | Intelligent Factory Connectivity: MES System Accessible
Reserved standard communication interface to realize seamless MES system integration.
Real-time uploading of programming data: production yield, burning quantity, defective rate, program version and equipment running status.
Facilitates full digital production traceability, perfectly fits intelligent automated workshop & automotive electronics, industrial control strict production management standards.

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