Ultra-Thin Etching Vapor Chambers for Superior Thermal Dissipation

Vapor Chamber Overview

Xinhaisen’s vapor chambers are ultra-thin, two-phase heat spreaders designed to efficiently transfer heat away from high-power components like CPUs, GPUs, LED arrays, and 5G modules. Utilizing precision chemical etching, we create optimized wick structures and vapor channels that outperform traditional heat pipes and solid metal heat sinks. Our vapor chambers ensure uniform temperature distribution, lower hotspot temperatures, and compact integration in space-constrained devices.

Vapor Chamber Key Advantages

1.Ultra-thin designs (as low as 0.3mm) for slim devices
2.High thermal conductivity (5-10x better than copper)
3.Custom wick structures (mesh, groove, sintered powder)
4.Leak-proof & long lifespan (robust laser welding & sealing)
5.Lightweight & corrosion-resistant (compatible with various working fluids)

Vapor Chambers Specification

Vapor Chambers Performance Data

1.30% lower thermal resistance vs. solid copper heat spreaders
2.Hotspot reduction from 100°C to <70°C in typical CPU applications
3.Uniformity: ±1°C across surface (for high-end electronics)

Vapor Chamber Applications

·Consumer Electronics: Smartphones, laptops, tablets
·5G & Telecom: Base stations, RF power amplifiers
·Automotive: EV battery cooling, LED headlights
·Aerospace: Avionics thermal management
·Medical Devices: Laser diode cooling

Quality Assurance

1.100% pressure & leak testing
2.Material certifications (RoHS, REACH compliant)
3.3D X-ray inspection for internal structure integrity

Why Choose Xinhaisen Vapor Chambers?

1.Precision etching ensures consistent micro-channel/wick structures

2.Fast prototyping (5-7 days for samples)

3.Mass production capacity: 100,000+ units/month

4.DFM support – Optimize designs for cost & performance

Request a quote today! Provide your thermal requirements for a customized solution.